OD150*ID123*1091 Stainless Steel 304 Stainless Steel Tube Target 

Target materials in the semiconductor industry. Semiconductor materials can be divided into wafer materials and packaging materials. Packaging materials have lower technical barriers compared with wafer manufacturing materials. There are seven types of semiconductor materials and chemicals involved in wafer production, one of which is sputtering target materials. The target material is one that is bombarded by high-speed charged particles. By changing different target materials (such as aluminum, copper, stainless steel, titanium, nickel targets, etc.), different film systems (such as superhard, wear-resistant, corrosion-resistant alloy films, etc.) can be obtained.

Purity is one of the main performance indexes of the target material, because the purity of the target material has a great influence on the performance of the film. But in practice, the purity requirements of target materials are also different. Impurities in solid materials and oxygen and water vapor in pores are the main sources of film deposition. In order to reduce the porosity of solid target material and improve the performance of sputtering film, the target material is usually required to have a high density. Density is also one of the key performance indexes of target materials. The density of the target material affects not only the sputtering rate but also the electrical and optical properties of the thin films. The higher the target density, the better the film forming performance. In addition, the density and strength of the target material can be improved by making the target material withstand thermal stress better during sputtering.