TS652D Thermal Release Tape for Wafer Dicing & Semiconductor Backgrinding | Heat-Activated No-Residue Temporary Bonding Tape PET 110-140C | MLCC LED Cutting&Die-Sorting Electronics Manufacturing | KHJ
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Brand:
KHJ
Product Description
Description
TS652D is a white film backed pressure-sensitive adhesive single- sided coated thermal release tape.With a high initial adhesion and easily peel off by heating under a certain high temperature (110-140°C) .
Features
* High initial adhesion and certain heat resistance ,no sticking back
* After heating ,easy to peel off and no any residual.
* Excellent tensile strength & Elongation
* RoHS Compliant
Application
* For electronic component ,glasses ,wafer ,ceramics manufacturing processes.
* For various temporary fixing
| Item | Typical Value | Test Method | ||
| Imperial | Metric | |||
| Backing | 4mils | 0.1mm | / | |
| Total Thickness | 6mils | 0.15mm | / | |
| 180°peel force(N/25mm) | Before heating | 1.98lbs/in | 9N/25mm | GBT 2792-2014 |
| After heating | 0 | 0 | ||
Recommended heating release Temperature: 110-140℃*5-15min (depending on the thermal conductivity and heating uniformity of the object )
Storage
- Store under normal conditions of 10-30℃ and 40-70% R.H, out of direct sunlight.
- Shelf life: 6 months from the date of manufacture when stored in initial packing.
Precaution Reminder
- Surface should be clean, dry, free of dust, oil or other contaminants.
- Proper pressure required by roller, hand or press when applying.
- Avoid repeat sticking to prevent adhesion decrease.
Notes
Please be advised that this technical data sheet is written based on our lab tests and experience only. Customer is responsible to determine the suitability of the product meets intended application requirements before approved for use.
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Company
Shenzhen KHJ Technology Co., Ltd
Location
KHJ Industrial park, Building 1,Chuangxin Industrial park, Xintian community, Guanlan, Longhua new district, Shenzhen,China 518110
Contact Person
Karina