KHJ TS651ZF Heat Release Tape Acrylic Adhesive Ultra-Thin Wafer Dicing Delicate Factory Manufacturer
PRODUCT DESCRIPTION
TS651ZF is a white heat-release adhesive tape with high initial tack. It retains adhesion at elevated temperatures until the adhesive foams and loses tack at 190℃, achieving automatic separation from the substrate.
Product Structure
Product Features
* Initial heat resistance; non-re-tacky
* High instantaneous adhesion with precise positioning; components are easily removed after heat debonding, leaving no adhesive residue
Product Applications
Suitable for temporary fixation and cutting protection of various components, ceramics, glass, metal plates, etc.
Performance Parameters
| Test Item | Specification | Test Method | |
| Substrate Thickness (μm) | 100±3 | Micrometer | |
| Product Thickness (excl. release liner) (μm) | 155±5 | Micrometer | |
|
180° Peel Adhesion (g/25mm) |
Before heat debonding | ≥500 |
Per GBT 2792-2014
|
| After heat debonding | Non-tacky | ||
◎ Recommended debonding process: 185℃–195℃ for 3–15 min. The adhesive layer is fully foamed and non-tacky; do not exceed 20 min of heating.
(Depending on the thermal conductivity and heating uniformity of the substrate)
Storage
Storage conditions: 10-30 ℃, relative humidity 40-60%. Shelf life: 6 months
Precautions
* Keep the product away from heat sources and open flames.
* The surface of the substrate must be clean, dry and free from oil or other contamination.
* Do not use the product outdoors; avoid outdoor weather conditions that may cause adhesive residue to remain on the substrate upon removal.
Get in Touch
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