1. Reliable functionality: the combination of blind vias, buried vias and micro vias make the PCB space smaller. The realization of stacked vias makes these boards a super shield against extreme environmental conditions, with more reliable performance

2. Improve signal integrity:

HDI combines in-pad via and blinds via technology. Components are closer together, reducing the length of the signal path. HDI technology eliminates stumps and reduces signal reflections, thereby improving signal quality.

3. Cost saving and high efficiency: The function of the standard 8-layer through-hole board can be simplified to a 6-layer HDI board without affecting the quality.