Aluminum base plating (metal base heat sink [including the aluminum base plate, copper base plate, iron base plate]) is a low-alloyed Al-Mg-Si series high-plasticity alloy plate (see the figure below for the structure). This has good thermal conductivity and electrical insulation performance as well as mechanical processing performance.

Compared to the traditional FR-4, the aluminum substrate adopts the same thickness and the same line width, can carry higher current, can withstand voltage up to 4500V, and the thermal conductivity is greater than 2.0. The industry is dominated by aluminum substrates.

Some other advantages include:

•  Usessurface mount technology (SMT);

Street lamp aluminum substrate

•  Extremely effective treatment of thermal diffusion in the circuit design scheme;
•  Reducesproduct operating temperature, improves product power density and reliability, extends product service life;
•  Reducesproduct volume and reduces hardware and assembly costs; and
•  Replaces fragile ceramic substrates to obtain better mechanical durability.

Aluminum layer characteristics

1.  circuit copper foil is 1ozto 10oz
2.  Insulation layer: The insulation layer is a layer of low thermal resistance,thermally conductive insulating material. Thickness: 0.003″ to 0.006″ is the core technology of aluminum-based copper clad laminates, which has obtained Underwriters Laboratories Inc. (UL)
3.  Aluminum Base layer: This is a metal substrate, generally aluminum or optionally This can be aluminum-based,copper-clad laminate and traditional epoxy glass cloth laminate, etc.

Compared to other materials, Aluminum PCBs use materials with incomparable advantages. Suitable for surface-mount technology (SMT) public art of power components. No radiator is needed, the volume is greatly reduced, the heat dissipation effect is excellent, and the insulation performance and mechanical performance are good.

The LED die (or semiconductor device) substrate is mainly used as a medium for heat dissipation between the LED die and the system circuit board. This substrate is combined with the LED die through the process of wire bonding, a eutectic system or flip chip. Based on heat dissipation considerations, the LED die substrates on the market are mainly ceramic substrates, which can be roughly divided into three types: thick film ceramic substrates, low temperature co-fired multilayer ceramics, and thin film ceramic substrates.

For high-power LED components, thick-film or low-temperature co-fired ceramic substrates are mostly used as die heat dissipation substrates, and then the LED die and the ceramic substrate are combined with gold wires.