HASL ENIG OSP Immersion Silver High Power LED Tube Light PCB
Led Tube Light Circuit Pcb Led Bulb Driver Pcb Design High Power Led Pcb
1. Introduction
As a kind of single-sided Aluminum PCB, LED PCB is widely used in street lamps, LED lamps, and household lamps.
2. Material: Aluminum-base PCB
| Item | Unit | Specification | Test condition | |
| Insulation thickness | um |
Max Min |
200 60 |
— |
| Solder resistance (288℃) | Sec. | Min | 600 | IPC-TM-650 2.4.13.1 |
| Thermal shock | 288℃10”/cycle | Min | 6 Times | IPC-TM-650 2.4.13.1 |
| Peel strength (Normal status) | lb/in | Min | 9 | IPC-TM-650 2.4.8 |
| Breakdown Voltage | V/mil | 750 | IPC-TM-650 2.5.6 | |
| Volume resistivity (Normal status＞E+14) | Ω · cm | 1.8*1015 | IPC-TM-650 2.5.17.1 | |
| Surface resistivity (Normal status＞E+12) | Ω | — | 3.5*1014 | IPC-TM-650 2.5.17.1 |
|
Dielectric constant 1 MHz Normal status 1 GHz Normal status |
— |
5.6 5.3 |
IPC-TM-650 2.5.5.3 2.5.5.5 2.5.5.6 |
|
|
Dissipation constant 1 MHz Normal status 1 GHz Normal status |
0.013 0.010 |
IPC-TM-650 2.5.5.3 2.5.5.5 2.5.5.9 |
||
| Water absorption | % | 0.2 | IPC-TM-650 2.6.2.1 | |
|
Thermal conductivity (measured on insulation layer only) |
W/m℃ | 1.0 | ASTM-E1461 | |
| Flammability | 94V-0 | Pass | IPC-TM-650 2.3.9 | |
| Tg | ℃ | 100 | IPC-TM-650 2.4.24 | |
| Td | ℃ | 410 | TBD (5wt% loss) | |
| MOT (RTI) | ℃ | 130 | UL746B | |
| CTI (Comparative Tracking Index) | V | ＞600 (PLC=0) | UL746E DSR |
3. Certification: UL, ROHS, Reach, ISO
4. Use range: Lighting, Automotive electronic equipment, Power supply, Electronic control, Computer equipment, Communication electronics etc.
5. What exhibitions have we participated in?
New Delhi Exhibition, Moscow Electronic Exhibition, etc.
6. Our Services
1. Quick response
2. Reasonable price based on good quality
3. Provide one-stop service (components, OEM)
4. Abundant inventory & Habitual material preparation
7. Payment method:
T/T, Paypal, credit card, Western Union, etc.
Structure of Aluminum PCB
Circuit Copper Layer
The circuit copper layer (usually using electrolytic copper foil) is etched to form a printed circuit, which is used to realize the assembly and connection of the device. Compared with the traditional FR-4, with the same thickness and the same line width, the aluminum substrate can carry a higher current.
Insulating Layer
The insulating layer is the core technology of the aluminum substrate, which mainly plays the functions of bonding, insulation and heat conduction. The aluminum substrate insulating layer is the largest thermal barrier in the power module structure. The better the thermal conductivity of the insulating layer, the more favorable it is to spread the heat generated during the operation of the device, and the lower the operating temperature of the device, so as to increase the power load of the module, reduce the volume, extend the life-span, and increase the power output .
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