Metal Core Prototype PCB Board For LED Lighting Industry
Led Lighting Pcb Electronic Pcb Board Prototype Pcb Board Metal Core Pcb
| Item | Unit | Specification | Test Condition | |
|---|---|---|---|---|
| Insulation Thickness | µm | Max Min |
200 60 |
- |
| Solder Resistance (288°C) | Sec. | Min | 600 | IPC-TM-650 2.4.13.1 |
| Thermal Shock | 288°C * 10"/cycle | Min | 6 Times | IPC-TM-650 2.4.13.1 |
| Peel Strength (Normal status) | lb/in | Min | 9 | IPC-TM-650 2.4.8 |
| Breakdown Voltage | V/mil | 750 | IPC-TM-650 2.5.6 | |
| Volume Resistivity (Normal status >E+14) | Ω * cm | 1.8x1015 | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity (Normal status >E+12) | Ω | 3.5x1014 | IPC-TM-650 2.5.17.1 | |
| Dielectric Constant 1 MHz Normal Status 1 GHz Normal Status |
- | 5.6 5.3 |
IPC-TM-650 2.5.5.3 IPC-TM-650 2.5.5.5 IPC-TM-650 2.5.5.6 |
|
| Dissipation Factor 1 MHz Normal Status 1 GHz Normal Status |
0.013 0.010 |
IPC-TM-650 2.5.5.3 IPC-TM-650 2.5.5.5 IPC-TM-650 2.5.5.9 |
||
| Water Absorption | % | 0.2 | IPC-TM-650 2.6.2.1 | |
| Thermal Conductivity (measured on insulation layer only) |
W/m°C | 1.0 | ASTM-E1461 | |
| Flammability | 94V-0 | Pass | IPC-TM-650 2.3.9 | |
| Tg | °C | 100 | IPC-TM-650 2.2.24 | |
| Td | °C | 410 | TBD (5wt% loss) | |
| MOT (RTI) | °C | 130 | UL 746B | |
| CTI (Comparative Tracking index) | V | 600 (PLC=0) | UL 746E DSR |
Technical Parameters
Layer count: 2
Board thickness:1.6mm
Dimension:650*10mm
Raw material:Aluminum base, thermal conductivity 1.0w
Copper thickness on the board surface:≥45um
Copper thickness in the hole barrel:25um
Min.line width/space:0.22mm
Minimum hole diameter:0.4mm
Surface finishing:OSP/HASL
Application: LED lighting
Structure of Aluminum PCBs:
Aluminum PCBs are aluminum based CCLs (CCL is a type of base material of PCBs). AluminumPCBs are actually quite similar to FR4 PCBs. The basic structure of Aluminum PCBs is four layered. It consists of a layer of copper foil, a dielectric layer, an aluminum base layer and aluminum base membrane.
- Copper Foil Layer: the copper layer used is relatively thicker than normal CCLs ( 1oz-10oz). A thicker layer of copper means a larger current carrying capacity.
- Dielectric Layer:the Dielectric layer is a thermally conductive layer and is around 50μm to 200μm thick. It had a low thermal resistance and it suitable for its application.
- Aluminum Base: The third layer isthe aluminum base which is made up of aluminum substrate. It has a high thermal conductivity.
- Aluminum Base Membrane Layer: Aluminum base membrane is selective. It has a protective role by keeping the aluminum surface safe from scraping and unwanted etching. It is of two types i.e. Lower than 120 degree or around 250 degrees (anti high temperature)
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