MX 1.25mm Pitch Horizontal 2-16 Pins SMT Wafer/Wire to Board Connector
MX 1.25mm Pitch Horizontal 2-16 Pins SMT Wafer/Wire to Board Connector
Product Description
The MX 1.25mm Pitch Horizontal SMT Wafer/Wire-to-Board Connector is a compact board-to-wire interconnection solution designed for space-limited electronic applications requiring reliable PCB mounting and wire-harness connections.
With a 1.25mm pitch miniature design, horizontal SMT mounting structure, and flexible pin configurations from 2 to 16 positions, this connector supports compact PCB layouts while maintaining efficient electrical connection between wires and printed circuit boards.
| Component | Material Options | Function |
|---|---|---|
| Insulator / Wafer Housing | LCP or Nylon 6T, UL94V-0 | Provides insulation, mechanical support, and high-temperature SMT compatibility |
| Contact Terminal | Brass / Copper Alloy | Provides electrical conductivity and mechanical contact force |
| Contact Plating | Tin over Nickel / Gold over Nickel (Optional) | Improves solderability and contact performance |
| Solder Tab | Copper Alloy / Phosphor Bronze | Enhances PCB mechanical fixation |
| Housing Color | Natural / Beige / Customized | Product identification and manufacturing requirements |
Design Advantages
1. Compact 1.25mm Pitch Design for Space-Saving Applications
The 1.25mm pitch structure provides a smaller connector footprint compared with traditional 2.0mm or 2.54mm pitch solutions.
Benefits for engineers:
- Reduced PCB occupied area;
- Suitable for miniaturized electronic products;
- Supports high-density PCB layouts;
- Flexible integration into compact modules.
2. Horizontal SMT Structure for Efficient PCB Assembly
The right-angle SMT configuration allows the connector to be mounted parallel to the PCB surface.
Advantages:
- Suitable for low-profile device designs;
- Compatible with automated SMT production lines;
- Helps optimize PCB component placement;
- Supports efficient mass production.
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