T2 Copper silver plating high precision machined parts for High voltage.
 
Description
 
This product has precision, and it is made by machining technology. The equipment also adopts machining equipment with high precision.
 

 
Silver Plate process
1. Degreasing
1. High temperature degreasing: normal temperature degreasing agent 5% + sodium hydroxide 5% / L, temperature 80 ℃ - 100 ℃.
2. Barrel deoiling: normal temperature deoiling agent 5% + sodium hydroxide 5% / 1 Temperature.
3. Electrolytic deoiling: electrolytic deoiling powder 5%, current density 2-5A / DM2, temperature 60 ℃ - 70 ℃.
 
2. Polishing
The purpose of general etching and bright etching is to remove the oxide layer on the surface of parts and the surface stains after oil removal. Ingredients: nitric acid, hydrochloric acid, water (20 ℃ - 40 ℃). 2. The purpose of bright etching is to make the surface of parts bright and fine. Ingredients: sulfuric acid, hydrochloric acid, sodium nitrate, water, brightener (20 ℃ - 35 ℃).
 
3. Passivation
Purpose: To remove the residue on the surface of parts after polishing.
 
4. Acid activated
To remove the passive film, increase the surface activity of the parts and the adhesion of the coating composition: hydrochloric acid, water or sulfuric acid, water time: 3min-5min.
 
5. The purpose of pre silver plating
To make the surface of parts generate copper and silver complexes, increase the adhesion between parts and coating, and increase the anti discoloration ability. Ingredients: silver cyanide (1g1), potassium cyanide (70g), pure water, current density: 0.3-0.5a/d.
 
6. Silver protection purpose
To form a very thin protective film of silver complex with the coating to improve the anti discoloration and anti-oxidation ability of the coating. Ingredients: Silver protector (1096), temperature (60 ℃± 5 ℃) and time: 1min.
 
7. Purpose of water washing
To prevent solvent pollution between processes.
 
Factory Display
 

 
Test Equipment
 

 

 

 
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