AZ91 Magnesium Alloy Semiconductor Heat Sink In Power Electronics
Magnesium Heat Sink Semiconductor heat sink AZ91 Fast heat dissipation For semiconductor testing magnesium alloy
Magnesium alloy has good lightness, machinability, corrosion resistance, shock absorption, dimensional stability and impact resistance, far superior to other materials.
These characteristics of magnesium alloys make magnesium alloys have applications in a wide range of fields, such as the transportation field, the electronics industry, the medical field, and the military industry. This trend is only increasing. Especially in 3C products (Computer, Consumer Electronic Product, Communication), high-speed rail, automobiles, bicycles, aerospace, architectural decoration, handheld tools, medical rehabilitation equipment and other fields have good application prospects and great potential. Become one of the development directions of new materials in the future.
Magnesium alloy heat sink has light weight and fast heat dissipation. These significant advantages make magnesium alloy heat sinks quickly replace aluminum alloy heat sinks to become the mainstream of the future, especially the rapid replacement in the semiconductor industry, which has unlimited potential.
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Product Name |
Heatsink;Magnesium heat sink;Die-cast heat sink |
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Material |
AZ91D,AZ31,ZK60,WE43,AZ80,etc |
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Detailed Size |
As per customers' design |
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Max Aspect Ratio( Fin Height / Fin Gap) |
More than 20 times aspect ratio heatsink can be extruded by 800 Tons--6000 Tons extruding machines by most advanced technology |
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Max Width |
Ultra wide extruded heatsink can be made by our unique friction welding technology |
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Standard Mold Qty |
60,000+ |
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Sample Service |
Samples with differernt sizes are availabe for prototypes test within 1 week |
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Production Process |
Die-casting blanks, CNC machining, deburring, shaping, micro-arc oxidation, spraying, inspection and packaging |
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Surface Treatment |
Micro arc oxidation, conductive oxidation, powder spraying |
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Reference Standard |
GB/T 3190-2008,GB/T 14846-2008,ISO 2768 |
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Experience |
More than 20 years professional manufacturing experience |
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Application |
Heat Sink, Semiconductor,LED lights, The electronic device cooling parts, Electronic and electronic chip cooling, Transportation Tools,Inverter,Welding Machine,Communication Device,Power Supply Equipment,Electronic Industry,Thermoelectric Coolers/Generator,IGBT/UPS Cooling Systems,etc. |
Sample photo
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