Uncooled LWIR Thermal Imaging Camera Core with 1280x1024 Resolution and 12μm Pixel Pitch
The COIN1212 infrared camera core features a megapixel 1280×1024/12μm wafer-level infrared detector, integrated with advanced signal processing circuits and imaging algorithms. It supports mainstream serial communication protocols and offers various video output interfaces with a comprehensive range of optical lens options. Capable of quickly detecting hotspots and delivering clear thermal images, it significantly streamlines secondary development. This provides an all-in-one thermal imaging integration solution for applications in key infrastructure monitoring, high-end manufacturing, intelligent transportation, scientific research, and other high-end thermal imaging applications.
- High-Definition Imaging, Precise Detection: 1280×1024/12μm megapixel resolution enables wide field-of-view and long-range HD imaging. Captures fine target details clearly during close-range observation.
- Full-Featured and Cost-Effective: Built with an industry-leading large-format wafer-level infrared detector. Integrated with advanced image processing algorithms to enhance image clarity and visual quality.
- Rapid Integration, Accelerated Development: Supports multiple image output interfaces including DVP and BT.1120. Outputs RAW/YUV image data with serial port control.
| Model | COIN1212 |
|---|---|
| IR Detectors Indicators | |
| Sensitive Material | VOx |
| Resolution | 1280×1024 |
| Pixel Size | 12μm |
| Spectral Response | 8μm ~ 14μm |
| Typical NETD | ≤40mK/F1.0/25℃ |
| Image Processing | |
| Digital Frame Rate | 30Hz |
| Start-up Time | 6s |
| Analog Video | / |
| Digital Video | RAW/YUV422 |
| Image Algorithm | Non-uniformity Correction (NUC) 3D Noise Reduction (3DNR) 2D Noise Suppression (DNS) Dynamic Range Compression (DRC) Edge Enhancement (EE) |
| Image Display | 10 Types (White Hot/Lava/Iron Red/Hot Iron/Medical/Arctic/Rainbow 1/Rainbow 2/Tint/Black Hot) |
| PC Software | ICC Software - Module Control & Video Display |
| Electrical | |
| Standard External Interface | 50pin: DF40C-50DP-0.4V(51), (HRS,Male) |
| Extension Board | USB3.0 |
| Communication Interface | TTL-232 |
| Digital Video Interface | DVP16/BT.1120/MIPI |
| Supply Voltage | 4.5~5.5V |
| Typical Power Consumption | 1.0W |
| Mechanical | |
| Bare Core Size(mm) | 14mm/19mm/25mm: 25.4mm×25.4mm×19.3mm 35mm/50mm/100m: 35.4mm×35.4mm×17.8mm |
| Bare Core Weight(g) | 14mm/19mm/25mm: 19.7±1g 35mm/50mm/100m: 32.5±1g |
| Environmental Adaptability | |
| Operating Temperature | -40℃~+70℃ |
| Storage Temperature | -45℃~+85℃ |
| Humidity | 5%~95%, non-condensing |
| Vibration | 5.35grms, Random Vibration, 3-axis |
| Impact | Half Sine Wave, 40g/11ms, Impact Direction X Axis, 3 times |
| Certification | ROHS2.0/REACH |
| Optical Lens | |
| Optical Lens | Fixed Focus Athermal: 14mm/19mm/25mm/35mm/50mm/100mm |
| Protection Level | IP67 (Front Lens) |
The COIN1212 thermal imaging module is applied in the field of Key Infrastructure Monitoring, High-end Manufacturing, Industrial Inspection, Scientific Research, etc.
- 8-inch 0.11μm VOx Uncooled Infrared Detectors
- 8-inch 0.5μm MCT Cooled Infrared Detectors
- 8-inch 0.5μm T2SL Cooled Infrared Detectors
- 6 million self-developed infrared detectors per year
- 30,000 m² semiconductor fabrication facility
- 20,000 m² cleanroom area
As an indicator of the clarity of thermal image, it shows the ability to resolve the spatial shape of the target and is usually expressed in mrad (milliradian).
Spatial resolution is a measure of the smallest object that can be resolved by the sensor, or the ground area imaged for the instantaneous field of view (IFOV) of the sensor. The IFOV is affected by the size of the individual detecting element, d and the focal length of the lens, f. That is iFOV = d / f.
For a given distance, the smaller spatial resolution value is, the smaller target and richer details can be seen. For a given target, the smaller spatial resolution value is, the longer range it will be detected.
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