Uncooled Infrared Camera Core with 1280x1024 Resolution and 12μm Pixel Pitch for High Performance Thermal Imaging
COIN1212 is a high-integration megapixel infrared camera core featuring 1280×1024/12μm wafer-level detection technology. It delivers HD thermal imaging and fast hotspot detection, supports multi-interface video output and serial control, and simplifies secondary development. This cost-effective, versatile solution is ideal for high-end thermal imaging applications including infrastructure monitoring, advanced manufacturing, intelligent transportation, and scientific research.
- High-Definition Imaging, Precise Detection
- 1280×1024/12μm megapixel resolution enables wide field-of-view and long-range HD imaging
- Captures fine target details clearly during close-range observation
- Full-Featured and Cost-Effective
- Built with an industry-leading large-format wafer-level infrared detector
- Integrated with advanced image processing algorithms to enhance image clarity and visual quality
- Rapid Integration, Accelerated Development
- Supports multiple image output interfaces including DVP and BT.1120
- Outputs RAW/YUV image data with serial port control
| Model | COIN1212 |
| IR Detectors Indicators | |
| Sensitive Material | VOx |
| Resolution | 1280×1024 |
| Pixel Size | 12μm |
| Spectral Response | 8μm ~ 14μm |
| Typical NETD | ≤40mK/F1.0/25℃ |
| Image Processing | |
| Digital Frame Rate | 30Hz |
| Start-up Time | 6s |
| Analog Video | / |
| Digital Video | RAW/YUV422 |
| Image Algorithm | Non-uniformity Correction (NUC) 3D Noise Reduction (3DNR) 2D Noise Suppression (DNS) Dynamic Range Compression (DRC) Edge Enhancement (EE) |
| Image Display | 10 Types (White Hot/Lava/Iron Red/Hot Iron/Medical/Arctic/Rainbow 1/Rainbow 2/Tint/Black Hot) |
| PC Software | |
| ICC Software | Module Control & Video Display |
| Electrical | |
| Standard External Interface | 50pin: DF40C-50DP-0.4V(51), (HRS,Male) |
| Extension Board | USB3.0 |
| Communication Interface | TTL-232 |
| Digital Video Interface | DVP16/BT.1120/MIPI |
| Supply Voltage | 4.5~5.5V |
| Typical Power Consumption | 1.0W |
| Mechanical | |
| Bare Core Size(mm) | 14mm/19mm/25mm: 25.4mm×25.4mm×19.3mm 35mm/50mm/100m: 35.4mm×35.4mm×17.8mm |
| Bare Core Weight(g) | 14mm/19mm/25mm: 19.7±1g 35mm/50mm/100m: 32.5±1g |
| Environmental Adaptability | |
| Operating Temperature | -40℃~+70℃ |
| Storage Temperature | -45℃~+85℃ |
| Humidity | 5%~95%, non-condensing |
| Vibration | 5.35grms, Random Vibration, 3-axis |
| Impact | Half Sine Wave, 40g/11ms, Impact Direction X Axis, 3 times |
| Certification | ROHS2.0/REACH |
| Optical Lens | |
| Optical Lens | Fixed Focus Athermal: 14mm/19mm/25mm/35mm/50mm/100mm |
| Protection Level | IP67(Front Lens) |
The COIN1212 thermal imaging module is applied in key infrastructure monitoring, high-end manufacturing, industrial inspection, scientific research, and related fields.
SensorMicro is the world's leading infrared detector manufacturer and service provider. We provide customers worldwide with high-performance uncooled and cooled thermal imaging detectors and share our professional application experience.
SensorMicro delivers advanced infrared detectors, camera cores, and modules with versatile formats and wavebands. Designed for clarity, sensitivity, and efficiency, our products integrate seamlessly into diverse systems—empowering next-generation imaging and sensing applications across industries.
SensorMicro detectors have been widely used in thermography, security & surveillance, personal vision, automotive, and consumer infrared products. Our volume production capability enables us to meet the growing demand from all existing and emerging markets.
- Infrared Detection: The thermal module contains an infrared detector that can sense electromagnetic radiation in the infrared range.
- Optics: The infrared radiation is focused onto the detector through an optical system, which may include a lens or an array of mirrors.
- Signal Amplification: The detected signal is amplified and digitized by the electronics inside the thermal module.
- Image Processing: The digitized signal is processed to produce a thermal image. This process involves several stages, including noise reduction, contrast enhancement, and color mapping. Additional features such as temperature measurement may be included.
- Display: The thermal image is then displayed on a screen, either inside the thermal module or on an external device.
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