Uncooled LWIR 256x192 / 12 μm Thermal Camera Core for Thermography, AIoT Applications

TIMO212 uncooled IR imaging module, also known as the uncooled thermal module, is radiometric-capable and features infrared non-contact temperature measurement functionality. It incorporates an exceptionally small 256x192 / 12μm wafer level package (WLP) infrared detector that captures long-wave infrared (LWIR) spectrum ranging from 8 to 14μm.

Thanks to WLP technology, the TIMO212 infrared camera module achieves ultra-compact structure and light weight while offering greater sensitivity and superior image quality at an affordable price, enabling customers to select the most suitable type according to their specific requirements.

• Ultra-Miniature Module with Ultimate SWaP-C Optimization
  • Wafer-level packaged detector + wafer-level optics + micro-electromagnetic valve shutter
  • The smallest infrared thermal module, enabling basic thermal imaging functionality with maximum cost efficiency
  • Compact size, lightweight, and low power consumption, ideal for integration into miniature devices
• Flexible Optic Options, Accurate Temperature Measurement
  • Multiple lens options available, including wide-angle and telephoto, to meet diverse application needs
  • High-precision temperature measurement with accuracy up to ±2°C; supports both regional and full-frame temperature monitoring
• Easy Integration, Fast Development
  • Supports DVP image interface, compatible with various embedded platforms
  • Compliant with RoHS 2.0 environmental standards

The TIMO212 thermal imaging module is widely used in many areas, including Thermography, Intelligent Hardware, Smart Building, Smart Home, AIoT, and more.

As a world-leading manufacturer and service provider of infrared detectors, SensorMicro boasts years of profound experience in infrared thermal imaging solutions. Guided by the core philosophy of "SensorMicro, Sense More" and driven by user needs, we are dedicated to unlocking the full potential of infrared technology, delivering high-performance products and professional services to customers worldwide.

Infrared waves cannot be seen with the human eye. Infrared detector / thermal imaging sensor is an optical-electrical device that reacts to infrared radiation and thermal energy and converts it into electrical signals, then outputs visible thermal images.

WLP refers to wafer level package. It is the process of completing high vacuum packaging directly on the entire MEMS wafer, then scribing and cutting to make a single infrared sensor. Together with metal package and ceramic package, they are the three main package formats of uncooled infrared detectors.

WLP IR detectors are specially designed to meet the miniaturization and low cost requirements in the application of infrared technology to consumer electronics market. We are now offering a variety of WLP infrared module solutions to boost more new applications in emerging markets.