Apex417W is a Wafer Level Packing (WLP) VOx uncooled focal plane array detector featuring 400x300 resolution with 17μm pixel size.

Wafer level packaging (WLP) represents the smallest, most cost-effective packaging solution, completing high vacuum packaging directly on the entire MEMS wafer before cutting into individual infrared detectors. This streamlined manufacturing process significantly reduces production time and costs.

The Apex417W uncooled LWIR infrared sensor is widely utilized across numerous applications including thermography, security monitoring, firefighting, autonomous driving, and personal vision systems.

• Tiny Size: 18x16x2.8mm
• Light Weight: <1.5g
• Low Power Consumption
• Sharp Image Presentation
• Versatile Application Compatibility

High sensitivity and excellent performance - World-leading technology in infrared industry

Various infrared detectors available - Both uncooled and cooled IR detectors in different formats and pixel sizes

Volume production to ensure fast delivery - Three production lines with annual production capability up to millions of detectors

Infrared thermal imaging utilizes infrared radiation and thermal energy to gather information about objects, converting invisible infrared radiation into visible thermal images that display temperature distribution across target surfaces. Different objects and even different parts of the same object exhibit varying radiation abilities and infrared reflection strengths.

• Night vision
• Search & rescue
• Non-destructive testing
• Epidemic prevention
• Thermography
• Security & monitoring
• Firefighting

A thermal imaging module typically consists of an infrared detector, infrared lens, and hardware electronics with embedded software and algorithms. It represents the minimum functional unit of a thermal imaging device.