Uncooled Thermal Imaging Module with 256x192 Resolution and 12μm Pixel Pitch for Low 330mW Power Consumption
The Mini212G2 uncooled IR imaging module represents an excellent low-cost thermal camera core solution, specifically designed for applications with strict requirements for small size, light weight, and competitive pricing in security and monitoring fields.
This module incorporates an exceptionally compact 256x192/12μm wafer level package (WLP) infrared detector that captures long-wave infrared (LWIR) spectrum ranging from 8 to 14μm. With fully optimized SWaP-C characteristics, the Mini212G2 thermal camera module integrates seamlessly into compact devices with strict size and weight constraints.
- Miniature Module with Direct Thermal Imaging Output: Equipped with self-developed 256×192/12μm wafer-level infrared detector offering significant cost advantages; ultra-compact structural design measuring only 17×17mm (PCBA) with weight as low as 4g; integrated ISP processing board and advanced image algorithms deliver clear thermal images directly
- Precise Detection, Flexible Configuration: High-precision temperature measurement with accuracy up to ±2℃; supports spot, area, and full-frame measurement; multiple field-of-view lens options available to meet various observation requirements
- Rich Interfaces for Easy Integration: Offers USB2.0, MIPI, DVP, BT.656, LVDS and other digital video output interfaces; fully compatible with industry-standard interfaces
| Model | Mini212G2 |
|---|---|
| Resolution | 256×192 |
| Pixel Size | 12μm |
| Spectral Response | 8~14μm |
| NETD | ≤50mK |
| Output Data | 14bit Raw |
| Frame Rate | Thermography: 25Hz, Imaging: 50Hz |
| Focus Mode | Focus Free |
| Lens (HFOV/FL) | 17.5°/10mm | 25°/7mm | 56°/3.2mm | 90°/2.1mm |
| Weight (g) | 7.1 | 6.4 | 4 | 6.8 |
| PCBA Size (mm) | 17×17 |
| Digital Video Interface | USB2.0 / MIPI / DVP / BT.656 / LVDS |
| Analog Video Interface | CVBS (PAL/NTSC) |
| Operating Voltage | 3.3V±0.1V |
| Typical Power Consumption | 330mW |
| Temperature Measurement Range | -20℃~+550℃ (-20℃~+150℃ | +100℃~550℃) |
| Temperature Measurement Accuracy | Greater of ±2℃ / ±2% |
| Operating Temperature | -40℃~+70℃ |
| Humidity | 5%~85% |
| Storage Temperature | -45℃~+85℃ |
| Certification | RoHS 2.0 / Reach |
This product is positioned for fields including AIoT, Machine Vision, Industrial Vision, Security Monitoring, and Night Observation.
- AIoT: Perfectly suitable for integration into compact AIoT devices such as smart home appliances, wearable devices, and intelligent environmental monitors
- Industrial Vision: Used for real-time monitoring of industrial equipment, laser processing and welding scenarios, semiconductor detection, and similar applications
- Security Monitoring: Capable of detecting illegal intruders and triggering real-time alarms
We offer a comprehensive range of product formats including infrared detectors, camera cores, and modules to meet various integration requirements.
- Rich Product Variety: Multiple array resolutions, pixel sizes, wavebands, and lens options combinations provide greater flexibility for diverse applications
- Outstanding Performance: Clear imaging, compact size, low power consumption, high sensitivity, and strong reliability—designed to perform under a wide range of environmental challenges
- Easy Integration: Multiple interface options make integration straightforward and enable rapid development across multiple application fields
Gray-white palette is more suitable for targets with small temperature differences.
Red and blue palette is more appropriate for scenes where problem points need to be identified.
Iron red is the standard color palette for the power industry.
Note: Regardless of which palette you choose, the thermal temperature measurements remain unchanged.
Standard lens: Suitable for normal targets at appropriate distances
Telephoto lens: Appropriate for relatively small targets that need to be viewed from long distances
Wide angle lens: Better for viewing more detail of objects at close distances
Macro lens: Designed for viewing very tiny targets at close distances, such as chip circuits
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