640x512 Resolution 12μm Pixel Pitch Thermal Camera Core with ≤25mK NETD for Fast Integration
The COIN612G2 thermal imaging camera core integrates a high-performance, cost-effective ApexCore wafer-level infrared detector with 640×512 resolution and 12μm pixel pitch, delivering a typical NETD of ≤25mK. Compatible with mainstream serial communication standards, this infrared camera core supports abundant video output interfaces and is paired with a full lineup of optical lens options to satisfy diverse application scenarios. It enables rapid hot-spot identification while rendering crisp thermal imagery, greatly lowering the complexity of secondary development. The COIN612G2 serves as an all-round thermal imaging integration module that balances comprehensive functionality and outstanding cost efficiency.
- Mini size: 25.4mm×25.4mm×15.7mm
- Light Weight: as low as 15±1g
- Power consumption: as low as 0.65W
- Various image processing algorithms: NUC/3DNR/DNS/DRC/EE
- High thermal sensitivity, Typical NETD ≤25mK/F1.0/25℃
- Supports USB 2.0/DVP/LVDS/BT.656 image output interfaces
- RAW/YUV image data output
- Serial port control
| Model | COIN612G2 |
|---|---|
| IR Detectors Indicators | |
| Sensitive Material | VOx |
| Resolution | 640×512 |
| Pixel Size | 12μm |
| Spectral Response | 8μm ~ 14μm |
| Typical NETD | ≤25mK/F1.0/25℃ |
| Image Processing | |
| Digital Frame Rate | 25/30/50Hz |
| Start-up Time | 6s |
| Analog Video | PAL/NTSC |
| Digital Video | RAW/YUV422 |
| Image Algorithm | Non-uniformity Correction (NUC) 3D Noise Reduction (3DNR) 2D Noise Suppression (DNS) Dynamic Range Compression (DRC) Edge Enhancement (EE) |
| Image Display | 10 Types (White Hot/Lava/Iron Red/Hot Iron/Medical/Arctic/Rainbow 1/Rainbow 2/Tint/Black Hot) |
| PC Software | |
| ICC Software | Module Control & Video Display |
| Electrical | |
| Standard External Interface | 50pin: DF40C-50DP-0.4V(51), (HRS,Male) |
| Extension Board | USB3.0/USB2.0/VPC/USB2.0&VPC |
| Communication Interface | TTL-232/USB2.0 |
| Digital Video Interface | DVP8/DVP16/USB2.0/BT.656/LVDS |
| Supply Voltage | 4.5~5.5V |
| Typical Power Consumption | 0.65W |
| Mechanical | |
| Bare Core Size(mm) | 25.4×25.4×15.7 |
| Bare Core Weight(g) | 15±1g |
| Environmental Adaptability | |
| Operating Temperature | -40℃~+70℃ |
| Storage Temperature | -45℃~+85℃ |
| Humidity | 5%~95%, non-condensing |
| Vibration | 5.35grms, Random Vibration, 3-axis |
| Impact | Half Sine Wave, 40g/11ms, Impact Direction X Axis, 3 times |
| Certification | ROHS2.0/REACH |
| Optical Lens | |
| Optical Lens | Fixed Focus Athermal: 4.8mm/7mm/9.1mm/13mm/19mm/25mm/35mm/50mm/70mm |
| Protection Level | IP67 (Front Lens) |
- Security Monitoring
- Industrial Vision
- Outdoor Observation
- Firefighting & Rescue
- ADAS
- Machine Vision
SensorMicro is dedicated to delivering comprehensive and professional services that underpin our customers' success throughout the entire project lifecycle. Our service system is built on the core values of reliability, responsiveness, and customization, ensuring that every customer receives tailored support that aligns with their unique business needs.
Infrared thermal imaging is a method which utilizes infrared radiation and thermal energy to gather information about objects. According to the radiation difference between the object and the background environment and the radiation difference of each part of the object itself, the infrared thermal image can show the radiation fluctuation of each part of the scene, thus showing the characteristics of the scene.
- See through total darkness
- Identification under camouflage
- Long range detection
- Heat distribution detection
- Non-contact temperature measurement
- Occupation awareness
- And so on
Temperature measurement and all-weather imaging are two basic functions of infrared thermal imaging technology. Products developed based on these two technologies are widely used in electric power, security & monitoring, industrial manufacturing, scientific research, medical treatment and other traditional fields.
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