SWaP-C Uncooled LWIR Thermal Imaging Module with 640x512 Resolution and 12μm Pixel Pitch at 0.65W Power Consumption
The COIN612G2 infrared camera core features a 640×512/12μm ApexCore wafer-level infrared detector with typical NETD ≤25mK, delivering an optimal balance between premium performance and cost-effectiveness. Its compact design, lightweight structure, and low power consumption of just 0.65W make it ideal for various applications. Enhanced image algorithms ensure sharper, clearer thermal imaging output.
Supporting mainstream serial communication protocols, multiple video output ports, and a comprehensive range of optical lenses, the COIN612G2 enables fast hot-spot detection and simplifies secondary development workflows, providing a fully functional, budget-friendly thermal integration solution.
- Comprehensive Functionality, Cost-Effective Solution
- High-performance ApexCore wafer-level infrared detector with NETD ≤25mK
- Advanced image processing algorithms for enhanced image quality
- Compact Structure, Lightweight Design
- Dimensions: 25.4×25.4×15.7mm
- Weight: 15±1g, Power consumption ≤0.65W
- Versatile Configuration, Rapid Integration
- Multiple lens options available for various application requirements
- Supports USB 2.0/DVP/LVDS/BT.656 image output interfaces
- Outputs RAW/YUV image data with serial port control
| Model | COIN612G2 |
| IR Detectors Indicators | |
| Sensitive Material | VOx |
| Resolution | 640×512 |
| Pixel Size | 12μm |
| Spectral Response | 8μm ~ 14μm |
| Typical NETD | ≤25mK/F1.0/25℃ |
| Image Processing | |
| Digital Frame Rate | 25/30/50Hz |
| Start-up Time | 6s |
| Analog Video | PAL/NTSC |
| Digital Video | RAW/YUV422 |
| Image Algorithm | Non-uniformity Correction (NUC) 3D Noise Reduction (3DNR) 2D Noise Suppression (DNS) Dynamic Range Compression (DRC) Edge Enhancement (EE) |
| Image Display | 10 Types (White Hot/Lava/Iron Red/Hot Iron/Medical/Arctic/Rainbow 1/Rainbow 2/Tint/Black Hot) |
| PC Software | |
| ICC Software | Module Control & Video Display |
| Electrical | |
| Standard External Interface | 50pin: DF40C-50DP-0.4V(51), (HRS,Male) |
| Extension Board | USB3.0/USB2.0/VPC/USB2.0&VPC |
| Communication Interface | TTL-232/USB2.0 |
| Digital Video Interface | DVP8/DVP16/USB2.0/BT.656/LVDS |
| Supply Voltage | 4.5~5.5V |
| Typical Power Consumption | 0.65W |
| Mechanical | |
| Bare Core Size(mm) | 25.4×25.4×15.7 |
| Bare Core Weight(g) | 15±1g |
| Environmental Adaptability | |
| Operating Temperature | -40℃~+70℃ |
| Storage Temperature | -45℃~+85℃ |
| Humidity | 5%~95%, non-condensing |
| Vibration | 5.35grms, Random Vibration, 3-axis |
| Impact | Half Sine Wave, 40g/11ms, Impact Direction X Axis, 3 times |
| Certification | ROHS2.0/REACH |
| Optical Lens | |
| Optical Lens | Fixed Focus Athermal: 4.8mm/7mm/9.1mm/13mm/19mm/25mm/35mm/50mm/70mm |
| Protection Level | IP67(Front Lens) |
The COIN612G2 thermal imaging module is applied in Security Monitoring, Industrial Vision, Outdoor Observation, Firefighting & Rescue, ADAS, Machine Vision, and related fields.
- Deep Technical Expertise: Years of experience in infrared sensor technology research, development, and application with capabilities across chip design, wafer fabrication, packaging, testing, and system integration.
- Focused on Innovation: Commitment to technological breakthroughs in thermal imaging, pushing boundaries in NETD, SWaP, and operating temperature across security, industrial monitoring, and intelligent systems.
- Diversified Product Portfolio: Comprehensive range of infrared detection components—both cooled and uncooled—providing tailored solutions for various industries.
- Rigorous Reliability Validation: Robust quality management system with multiple testing procedures to ensure long-term stability and reliability.
- Professional Technical Support: Engineering team works closely with customers to accelerate system integration, improve efficiency, and shorten time-to-market.
Infrared thermal imaging utilizes infrared radiation and thermal energy to gather information about objects. It converts invisible infrared radiation into visible infrared thermal images showing temperature distribution of target surfaces. Different objects and even different parts of the same object have different radiation ability and infrared reflection strength.
Night vision, Search & rescue, Non-destructive testing, Epidemic prevention, Thermography, Security & monitoring, Firefighting, and more.
A thermal imaging module typically consists of an infrared detector, infrared lens, and hardware electronics with embedded software and algorithms. It represents the minimum functional unit of a thermal imaging device.
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