VOx Uncooled Thermal Camera Core with 640x512 Resolution 12μm Pixel Size and Longwave 8~14μm Spectral Range

COIN612G2 uncooled infrared module integrates 640x512 / 12μm wafer level package (WLP) infrared imaging detector, high performance signal processing circuit and image processing algorithm. Thanks to the wafer level packaging technology, the WLP infrared detector has simpler manufacturing process and easier to be integrated, which is more suitable for high volume and low cost production.

The COIN612G2 infrared module features sharp and crisp thermal image presentation, compact size and low cost. Until now, we have provided our customers with various mature and stable infrared thermal imaging solutions. It's easier for COIN series infrared modules to be integrated into more terminal products and greatly reduces the cost for customers.

• Comprehensive Functionality, Cost-Effective Solution
  • Developed with a high-performance, cost-efficient ApexCore wafer-level infrared detector with NETD ≤25mK
  • Combines a mainstream FPA with advanced image processing algorithms to enhance image quality
• Compact Structure, Lightweight Design
  • Dimensions: 25.4×25.4×15.7mm
  • Weight: 15±1g, Power consumption≤0.65W
• Versatile Configuration, Rapid Integration
  • Multiple lens options available to meet various application requirements
  • Supports USB 2.0/DVP/LVDS/BT.656 image output interfaces
  • Outputs RAW/YUV image data with serial port control

The COIN612G2 infrared camera core is widely used in Security Monitoring, Industrial Vision, Outdoor Observation, Firefighting & Rescue, ADAS, Machine Vision etc.

• Product Customization: Adjust configurations and adapt algorithms to meet industry-specific requirements
• On-Site Technical Support & Training: Provide core customers with hands-on system setup and operational training
• Joint Innovation for New Products & Markets: Collaborate with customers to co-develop innovative infrared application solutions