Beijing Haina Lean Technology Co., Ltd
                                                                                                           
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20 Years
Since 2006
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Machinery Electronics Production Machinery

Finger Gold 4-6 Layer 4oz Electronics Pcb Assembly

Price Negotiable
Price: Negotiable
MOQ: 1 PC
Delivery Time: 1-7days
Brand: HNL-PCBA
Product Description

Multilayer Finger Gold 4-6 layer pcb Printed Circuit Board Assembly

 

Turnkey PCB Assembly Introduction

 

Turnkey PCB assembly means that the supplier handles all aspects of PCB solutions, including components procuring and PCB manufacturing, picking and placing components on specific locations on your custom PCBs. In essence, full turnkey PCB assembly gives the buyer greater freedom to focus on PCB design, while the supplier takes care of the rest, which is why it is a leading form of one-stop electronic assembly .

PCB CAPABILITIES 

 

FACTORY CAPABILITIES
No. Items 2019 2020
1 HDI Capabilities HDI ELIC (4+2+4) HDI ELIC(5+2+5)
2 Max layer count 32L 36L
3 Board Thickness Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm
4 Min.Hole Size

Laser 0.075mm

Mechnical 0.15

Laser 0.05mm

Mechnical 0.15

5 Min Line Width/Space 0.035mm/0.035 0.030mm/0.030mm
6 Copper Thickness 1/3oz-4oz 1/3oz-6oz
7 Size Max Panel size 700x610mm 700x610mm
8 Registration Accuracy +/-0.05mm +/-0.05mm
9 Routing Accuracy +/-0.075mm +/-0.05mm
10 Min.BGA PAD 0.15mm 0.125mm
11 Max Aspect Ratio 10:1 10:1
12 Bow and Twist 0.50% 0.50%
13 Impedance Control Tolerance +/-8% +/-5%
14 Daily output 3,000m2 (Max capacity of equipment) 4,000m2 (Max capacity of equipment)
15 Surface Finishing HASL Lead Free /ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD
16 Raw Material FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI

 

PCBA CAPABILITIES

 

PCBA Capability
Material Type Item Min Max
PCB Dimension (length,width,height.mm) 50*40*0.38 600*400*4.2
Material FR-4,CEM-1,CEM-3,Aluminium-based board,Rogers,ceramic plate,FPC
Surface finish HASL,OSP,Immersion gold,Flash Gold Finger
Components Chip&IC 1005 55mm
BGA Pitch 0.3mm -
QFP Pitch 0.3mm -

 

Our advantage

 

Service value

Independent quotation system to quickly serve the market

 

PCB manufacturing

High-tech PCB and PCB assembly production line

 

Material purchasing

A team of experienced electronic component procurement engineers

 

SMT post soldering

Dust-free workshop, high-end SMT patch processing

 

 

 

Turnkey PCB Assembly Application Field 

 

Our products are widely used in communication equipment, industrial control, consumer electronics, medical equipment, aerospace, light-emitting diode lighting, automotive electronics.

 

Workshop

 

 

 

Partners

 

 

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Haina Lean Technology Co., Ltd
Location Room 704-3, 7 / F, Building 9, Yard 8, Development Road, Changping District, Beijing
Contact Person Marina

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