6 Layer 3 Mil Smd Pcb Smt Assembly For Communication
6 Layer 3 Mil SMD SMT PCB Assembly For communication
Printed Circuit SMT Board Assembly Introduction
Haina lean Electronics is a one-stop EMS supplier integrating PCB design, PCB manufacturing, Component sourcing and PCB assembly.
The company is specialized in electronic products supporting processing services, mainly to undertake circuit board design, layout production, components procurement, PCB plate making, circuit board welding assembly debugging and other OEM/ODM services.
Our engineers is qualified and experienced in producing surface-mount (SMT), through-hole (THT) and mixed-technology components and fine-pitch parts and ball grid arrays (BGAs) for high-density FR-4 PCBs .
PCB CAPABILITIES
| No. | Items | |
| 1 | HDI Capabilities | HDI ELIC(5+2+5) |
| 2 | Max layer count | 36L |
| 3 | Board Thickness | Core thickness 0.05mm-1.5mm ,Fineshed board thickness0.3-3.5mm |
| 4 | Min.Hole Size | Laser 0.05mm |
| Mechnical 0.15 | ||
| 5 | Min Line Width/Space | 0.030mm/0.030mm |
| 6 | Copper Thickness | 1/3oz-6oz |
| 7 | Size Max Panel size | 700x610mm |
| 8 | Registration Accuracy | +/-0.05mm |
| 9 | Routing Accuracy | +/-0.05mm |
| 10 | Min.BGA PAD | 0.125mm |
| 11 | Max Aspect Ratio | 10:01 |
| 12 | Bow and Twist | 0.50% |
| 13 | Impedance Control Tolerance | +/-5% |
| 14 | Daily output | 4,000m2 (Max capacity of equipment) |
| 15 | Surface Finishing | ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD |
| 16 | Raw Material | FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI |
PCBA CAPABILITIES
| PCBA Capability | |||
| Material Type | Item | Min | Max |
| PCB | Dimension (length,width,height.mm) | 50*40*0.38 | 600*400*4.2 |
| Material | FR-4,CEM-1,CEM-3,Aluminium-based board,Rogers,ceramic plate,FPC | ||
| Surface finish | HASL,OSP,Immersion gold,Flash Gold Finger | ||
| Components | Chip&IC | 1005 | 55mm |
| BGA Pitch | 0.3mm | - | |
| QFP Pitch | 0.3mm | - | |
Our advantage
|
Service value Independent quotation system to quickly serve the market |
PCB manufacturing High-tech PCB and PCB assembly production line |
|
Material purchasing A team of experienced electronic component procurement engineers |
SMT post soldering Dust-free workshop, high-end SMT patch processing |
Delivery Time
| Product Type | Qty | Normal lead time | Quick-turn lead time |
| SMT+DIP | 1-50 | 1WD-2WD | 8H |
| SMT+DIP | 51-200 | 2WD-3WD | 1.5WD |
| SMT+DIP | 201-2000 | 3WD-4WD | 2WD |
| SMT+DIP | ≥2001 | 4WD-5WD | 3WD |
| PCBA(2-4Layer) | 1-50 | 2.5WD-3.5WD | 1WD |
| PCBA(2-4Layer) | 51-2000 | 5WD-6WD | 2.5WD |
| PCBA(2-4Layer) | ≥2001 | ≥7WD | 5WD |
| PCBA(6-10Layer) | 1-50 | 3WD-4WD | 2.5WD |
| PCBA(6-10Layer) | 51-2000 | 7WD-8WD | 6WD |
| PCBA(10-HDILayer) | 1-50 | 7WD-9WD | 5WD |
| PCBA(10-HDILayer) | 51-2000 | 9WD-11WD | 7WD |
Printed Circuit SMT Board Assembly Application Field
Assembled Printed Circuit Boards are mainly used for many communication industry, medical equipments, consumer electronics and automobile industry ,automotive electronics , audio and video, optoelectronics, robotics, hydroelectric power, aerospace, education, power supply, printer etc industries.
Workshop
Partners
Common packaging
PCB: Vacuum packaging with carton box
PCBA: ESD packaging with carton box
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.