UFB2750K60N UFB2752Q12N-32G UFB2752Q12N-64G UFB2752Q12N-128G
Price:
Negotiated
MOQ:
100pieces
Delivery Time:
Negotiable
Product Description
UFB2750K60N UFB2752Q12N-32G UFB2752Q12N-64G UFB2752Q12N-128G UFS IC Chips
UFS
As a next-generation embedded memory chip, the BIWIN UFS chip is three times faster than the latest eMMC 5.1 standard. In addition, UFS 2.1's faster performance could effectively ensure the safe transmission of data without unnecessary lag caused by reading and writing operations, which is the key to the higher speed achieved in UFS 2.1. In addition to its huge advantages in transfer speed, BIWIN UFS 2.1 also has excellent power consumption characteristics.
Application:
Notebook / Smart Phone
Specification:
| Interface | UFS 2.1 / UFS 2.1 / UFS 3.1 |
| Dimensions | 11.50 × 13.00 mm |
| Max. Sequential Read | UFS 2.1: 500 MB/s |
| UFS 2.1: 500 MB/s | |
| UFS 3.1: 1200 MB/s | |
| Max. Sequential Write | UFS 2.1: 856 MB/s |
| UFS 2.1: 856 MB/s | |
| UFS 3.1: 300 MB/s | |
| Frequency | / |
| Capacity | UFS 2.1: 128 GB - 256 GB |
| UFS 2.1: 128 GB - 256 GB | |
| UFS 3.1: 128GB - 512GB | |
| Working Voltage | UFS 2.1: VCC=3.3 V, VCCQ=1.8 V |
| UFS 2.1: VCC=3.3 V, VCCQ=1.8 V | |
| UFS 3.1: VCC=3.3 V, VCCQ=1.2 V / 1.8 V | |
| Working Temperature | -20℃ - 85℃ |
| Approved Verification Platforms | UFS 2.1: Qualcomm: 835, 845... |
| UFS 2.1: Qualcomm: 835, 845… | |
| UFS 3.1: Qualcomm, MediaTek... | |
| Packaging | FBGA153 |
| Application | Notebook / Smart Phone |
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Company
Angel Technology Electronics Co
Location
FL16 Coastal Buidling East Block Nanshan District Shenzhen China 518000
Contact Person
Sophia