PCB Polyimide Film Adhesive Tape H Grade 0.06mm Thickness 280°C Temperature Resistant No Releasing

Price Negotiable

Price: Usd1~5/roll

MOQ: 500m2

Delivery Time: 35 working days

Product Description

Product Overview

PCB Polyimide Film Adhesive Tape H Grade is a high-performance industrial tape featuring exceptional thermal stability and electrical insulation properties. This no-releasing tape provides reliable protection for electronic components during demanding manufacturing processes.

Material Composition

Base Film: Polyimide (PI) Film
Adhesive: Silicone Adhesive

Visual Characteristics

Amber transparent appearance with smooth surface, free from creases, bubbles, foreign objects. No tearing or glue layer transfer during unwinding.

Key Performance Features

High mechanical strength and excellent electrical insulation
Superior dimensional stability and temperature resistance
Resistant to solvents and water
Long-term working temperature: 220°C, short-term: 280°C

Industrial Applications

Electronic protection during bonding processes including SMT wave soldering and reflow soldering
PCB board gold finger protection and SMD electronic components
Transformers, relays, and electronic switches requiring high-temperature moisture protection
Electrical insulation wrapping for H-class motors and transformers
High-temperature coil wrapping and thermal resistance protection

Technical Specifications

Parameter	2321 / 2321L
Total Thickness (mm)	0.06±0.003
Base Film Thickness (mm)	0.025±0.003
Breakdown Voltage (KV)	≥5
Insulation Resistance (Ω)	≥10¹³
Tensile Strength (N/10mm)	≥40
Elongation (%)	≥45
Adhesion Strength to Steel (N/10mm)	≥2.4
Working Temperature (°C)	-73~280
Chemical Resistance (20% HCL NaOH/10Hrs)	Bonding well, no delamination, no glue layer transfer
Releasing Film	No / 0.075mm