EMI RFI Shielding Can Metal Stamping Cover with ±0.05mm Precision Tolerance and 0.2mm-1.0mm Thickness Range for SMT Assembly

EMI/RFI Shielding Can Metal Stamping

The EMI Shielding Can Metal Stamping provides critical electromagnetic interference protection for sensitive electronic circuits. Manufactured using fine blanking progressive die technology with ±0.05mm precision tolerance, these thin-gauge stamped parts are designed for automated SMT pick-and-place assembly.

Available in tin-plated steel, nickel silver, and copper alloy materials with thickness from 0.2mm to 1.0mm. Our shielding solutions cover a wide range of electronic applications from consumer devices to industrial and automotive electronics requiring RoHS-compliant EMI protection.

Key Features

• Fine Blanking Precision: ±0.05mm tolerance for consistent PCB fitment
• Thin Gauge Expertise: 0.2mm-1.0mm ultra-thin material stamping capability
• SMT Compatible: Designed for automated pick-and-place assembly with flat coplanarity
• Multiple Plating Options: Bright tin, matte tin, and nickel surface finishes
• RoHS Compliant: Lead-free materials and plating meeting global environmental standards

Technical Specifications

Applications

• Smartphone and tablet PCB shielding
• WiFi and Bluetooth module RF cans
• Automotive ECU electronic shielding
• Medical device circuit protection
• IoT sensor module EMI enclosures

FAQ

Q: Can you produce two-piece shield frame and cover sets?
A: Yes, we manufacture both shield frames (soldered to PCB) and removable snap-on covers with precise interlocking features.

Q: What flatness tolerance can you guarantee?
A: We achieve coplanarity of 0.1mm maximum across the entire shield footprint to ensure reliable SMT placement.

Q: Do you offer tape and reel packaging for SMT assembly?
A: Yes, we provide tape and reel packaging compatible with standard SMT feeder systems for automated assembly lines.