0.8mm 8cm BGA Reballing Machine

Price Negotiable

Price: USD 8000-9500/unit

MOQ: 1unit

Delivery Time: 5-7 working days

Product Description

Specification and Feature:

High precision K-type Closed Loop import from USA together with our company special heating way,the soldering rang of temperature within±1 degree
Imported optical alignment system with 15’’high definition monitor;high precision micrometer adjust X/Y/R axis;make sure the alignment precision within 0.01-0.02mm.
Top heater and mounting heater design 2 in 1 which can make the mounting more precision;there are many sizes of BGA nozzles which can meet different chips sizes,BGA nozzles can easy change,we accept customize.
High automatic and precision,Completely avoid human operation error; it is good for reworking lead free craft and double BGA,QFN,QFP,capacitance-type resistor components which can achieve good result.
Additional monitoring camera which can observe the solder ball melting and easy to check the temperature curve and the soldering result(optional function )

Technology Parameter:

Power	6800W
Up heater power	1200W
Down heater power	1200W
IR heater power	4200W(2400W control)
Power supply	(Single Phase) AC 220V±10 50Hz
Position way	Optical lens+ Vshape holder+laser positioning
Temperature control	High precision K shape sensor(Closed Loop),up and down independent temperature heating zone,Precision can reach±1℃
Material	High sensitive touch screen+temperature control module+PLC+step drive
PCB Size	Max:500×450mm , Min: 10×10mm
Thermo-couple Ports	4pcs
Chips magnification times	2-30
PCB thickness	0.5-8mm
GA size	0.8mm-8cm
Min.chips pitch	0.15mm
Mounting BGA weight	1000G
Mounting precision	±0.01mm
Overall dimension	L670×W780×H850mm
Optical alignment lens	Motor drive can move front back right left
Weight of machine	About 90kg