Metal Bond Diamond Grinding Wheel for Silicon Wafer Edge Grinding
Price:
FOB
MOQ:
2 pcs
Delivery Time:
5 work days
Brand:
Shine Abrasives
Product Description
Metal Bond Diamond Grinding Wheel for Silicon Wafer Edge Grinding
Product Overview
Metal bond and resin bond wheels are specifically designed for edge grinding on the outer circumference of silicon wafers. These wheels deliver uniform sharpness while maintaining precision accuracy in wheel shape and exceptional abrasion resistance. Available for both outer-circumference machining and notch machining, our wheels come in three types: single-groove, multi-groove, and composite rough finishing.
| Name | Metal bond grinding wheel |
|---|---|
| Grinding method | Dry or Wet grinding |
| Diameter | 100mm, 120mm, 160mm, 200mm, 250mm, 300mm, customized |
| Arbor hole | 16mm, 17mm, 22mm, 32mm or customized |
| Grit size | 80# 120# 150# 200# 240# 280# 320# 350# 380# 400# 450# 500# 600# 800#, customized |
| Model | 1A1, 1A1R, 1V1, 6A2, 12A2, 11A2, 11V9, etc |
Key Benefits
- Low maintenance requirements
- Increased production output
- Exceptional wear resistance
- Longer-lasting wheel sharpness
- Superior heat transfer from ground material
- Extended product life cycle
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
ZHENGZHOU SHINE ABRASIVES CO.,LTD
Location
2824,Building B, No.171, Zhongyuan Middle Road, Zhengzhou, Henan 450007, China.
Contact Person
Lenny Li