Hybrid Bond Diamond CNC Grinding Wheel 11V9 for Technical Ceramic Wafer Grinding
Price:
USD 70-180 / Piece
MOQ:
2 Pieces
Delivery Time:
7-15 working days after deposit
Brand:
Shine Abrasives
Product Description
Hybrid Bond Diamond CNC Grinding Wheel for Technical Ceramics & Wafers
Designed for precision grinding of technical ceramics, silicon carbide and semiconductor components. The 11V9 hybrid bond diamond wheel combines the cool, free cutting of resin with the form-holding stability of metal bond, controlling heat and subsurface damage.
Key Advantages
- Cool cutting for ceramics, silicon carbide and metal-ceramic composites
- Excellent precision at high feed rates with minimal chipping
- Maintains form and edge quality over long cycles
- Suitable for water-based and oil-based coolant systems
Specifications
| Bond Type | Hybrid (Resin + Metal) |
| Shape | 11V9 |
| Diameter | 150mm / 6 inch |
| Bore | 31.75mm |
| Grit Size | D46 |
| Concentration | 125% |
| Core Material | Aluminum / Steel |
Applications
Technical ceramic and advanced ceramic grinding, silicon carbide components, semiconductor wafer edge and surface grinding, metal-ceramic composite machining.
Sizes and bond formulations can be customized. Contact us for a quote.
Similar Products
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
ZHENGZHOU SHINE ABRASIVES CO.,LTD
Location
2824,Building B, No.171, Zhongyuan Middle Road, Zhengzhou, Henan 450007, China.
Contact Person
Lenny Li