6A2 Resin Bond Diamond Grinding Wheel 150mm Grit 120 For Ceramic Silicon Wafer
Price:
USD 16-35 / Piece
MOQ:
10 Pieces
Delivery Time:
5-7 days for stock, 15-20 days for production
Brand:
BOSDI
Product Description
6A2 Resin Bond Diamond Grinding Wheel 150mm for Ceramic, Silicon and Thermal Spray Grinding
The 6A2 resin bond diamond grinding wheel handles a broad range of high-hardness materials including ceramic, silicon, glass, quartz and thermal spraying alloys. Its resin bond structure keeps the wheel cool and sharp for efficient surface grinding.
Product Highlights
- High Grinding Efficiency: Sharp cutting for fast stock removal on hard, brittle materials
- Broad Material Compatibility: Works on ceramic, silicon, glass, quartz and thermal spraying alloys
- Less Heat Generation: Resin bond limits grinding burn and protects the workpiece
- Stable Performance: Good shape retention and long service life lower cost per part
Specifications
| Bond | Resin Bond |
| Abrasive | Synthetic Diamond |
| Working Style | Surface Grinding |
| Origin | China |
| Packing | Carton and wooden case |
| Shape | 6A2 Cylindrical |
| Diameter | 150mm |
| Grit | 120 |
Applications
- Ceramic and silicon wafer grinding
- Glass and quartz machining
- Thermal spraying alloy grinding
Our Advantages
- High grinding efficiency on hard materials
- Wide range of applications and materials
- Lower grinding heat and fewer burn marks
- OEM/ODM customization of size, grit and bond
OEM/ODM customization of size, grit and bond is available. Contact us for a quote and sample discussion.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
ZHENGZHOU SHINE ABRASIVES CO.,LTD
Location
2824,Building B, No.171, Zhongyuan Middle Road, Zhengzhou, Henan 450007, China.
Contact Person
Lenny Li