UV Curing Phone Sealing Gasket Adhesive Fast Cure Solvent Free High Thixotropy Compression Rebound
UV Curing Phone Sealing Gasket Adhesive
3508 UV Curing Phone Sealing Gasket Adhesive is a red / blue, fast-curing and solvent-free UV adhesive specially formulated for phone sealing gasket and formed-in-place gasket (FIPG) applications. It combines fast UV curing, high thixotropy with excellent stacking and bead retention, outstanding compression rebound, and excellent adhesion to metals and plastics. It is also resistant to wave soldering and reflow soldering processes, making it ideal for reliable sealing and waterproofing of mobile phones and precision electronic devices.
Key Features
- Fast curing and solvent-free UV formulation
- Resistant to wave soldering and reflow soldering processes
- High thixotropy with excellent stacking and bead retention
- Excellent compression rebound and elastic recovery
- Excellent adhesion to metals and plastics
- Soft Shore A 52 hardness with 300% elongation at break
Applications
- Phone sealing gasket and formed-in-place gasket (FIPG) sealing
- Waterproof and dustproof sealing of mobile phone housings
- Bonding and sealing of metal and plastic components
- Electronic device sealing requiring wave / reflow soldering resistance
- Cushioning and compression sealing of precision components
Technical Specifications
| Color | Red / Blue |
| Viscosity (25°C) | 75000±15000 mPa.s |
| Curing Condition | 800 mJ/cm² (UV) |
| Hardness | Shore A 52 |
| Tensile Strength | 2.5 MPa |
| Elongation at Break | 300% |
| Shelf Life | 12 months (8-28°C) |
| Packaging | 50g / 1kg |
FAQ
Q1: What is the 3508 adhesive mainly used for?
3508 is a UV curing phone sealing gasket adhesive for formed-in-place gasket (FIPG) sealing and waterproofing of mobile phones and precision electronic devices.
Q2: How fast does it cure and is it solvent free?
3508 cures quickly under UV light at 800 mJ/cm² and is a solvent-free formulation, delivering a fast yet odorless and environmentally friendly bonding process.
Q3: Is it resistant to soldering processes?
Yes. 3508 is resistant to both wave soldering and reflow soldering, allowing it to withstand the thermal conditions of typical electronics assembly lines.
Q4: What are the thixotropy and stacking performance?
3508 features high thixotropy with excellent stacking and bead retention, so it maintains its shape after dispensing without sagging, even on vertical or complex surfaces.
Q5: What materials does it adhere to?
3508 provides excellent adhesion to both metals and plastics, making it suitable for sealing and bonding metal and plastic components of phone housings and other electronic assemblies.
Q6: What are the storage conditions and packaging?
Store at 8-28°C in the original sealed container. Shelf life is 12 months. Available in 50g and 1kg packaging.
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