The Polycondensate Of Dimer Acid And Diamine Polyamide Resin For Melting Adhesive
The Polycondensate Of Dimer Acid And Diamine Polyamide Resin For Melting Adhesive
Instruction:
Polyamide resin is also a polyamide hot melt adhesive, which is a condensation of dimeric acid and diamine. This product is solid at room temperature and liquid in the molten state, it has good fluidity and bonding ability, and will form high strength adhesion after solidification and cooling. In addition, it is also a polyamide resin is also a polyamide hot melt adhesive, which is a polycondensation of dimeric acid and diamine. This product is solid at room temperature and liquid in the molten state, it has good fluidity and bonding ability, and will form high strength adhesion after solidification and cooling. In addition, it also has excellent thermal stability and flexibility, and has good solubility and melting property at low temperatures. It has excellent thermal stability and flexibility, and has good solubility and melting property at low temperatures.
Polyamide Resin is light yellow granular transparent solid product, which is non- toxic, no irritant, dissolve in most organic solvents, insoluble in water. polyamide hot melt adhesive has a good solubility at low temperature.
Application: It mainly used for attire, shoes, leather, electronic devices, melting adhesive. Also used for wood, plastic, metal, ceramics etc
Specification:
| Item | |
| BT-208A | |
| Acid value ( mgKOH/ g) | ≤ 5 |
| Amine value (mgKOH/ g) | ≤ 5 |
| Solvent viscosity* (mPa · s/25℃) | 150- 190 |
| Melt viscosity (mPa ·s/ 160℃) | 1500-3000 |
| Softening point (℃) | 105- 115 |
| Color (Fe-Co) | ≤ 8 |
Packing: 25kgs net each bag
Storage: to be stored in cool, ventilated and dry place
Certification:
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