Dissolve In Most Organic Solvents Polyamide Resin For Attire And Leather
Dissolve In Most Organic Solvents Polyamide Resin For Attire And Leather
Instruction:
Polyamide hot melt adhesive is a light yellow granular transparent solid, it is a condensation of dimeric acid and diamine. Polyamide hot melt adhesive is a light yellow granular transparent solid, it is a condensation of dimeric acid and diamine. It is non-toxic, non-irritating, soluble in most solvents, insoluble in water, solid at room temperature, but the liquefied liquid molten state, with good fluidity and bonding ability, will form high strength adhesion after solidification and cooling. Polyamide hot melt adhesive has excellent thermal stability and flexibility, and has good solubility and melting property at low temperature. It is non-toxic, non-irritating, soluble in most solvents, insoluble in water, solid at room temperature, but the liquefied liquid molten state, with good fluidity and bonding ability, will form high strength adhesion after solidification and cooling. Polyamide hot melt adhesive has excellent thermal stability and flexibility, and has good solubility and melting property at low temperature.
Application:
1.attire, leather.
2.electronic devices
3.melting adhesive
4.wood, plastic, metal, ceramics etc
Specification:
| Item | |
| BT-208B | |
| Acid value ( mgKOH/ g) | ≤ 5 |
| Amine value (mgKOH/ g) | ≤ 5 |
| Solvent viscosity* (mPa · s/25℃) | 200-300 |
| Melt viscosity (mPa ·s/ 160℃) | 2000-4500 |
| Softening point (℃) | 105- 115 |
| Color (Fe-Co) | ≤ 8 |
Packing: 25kgs per bag
Storage: It need to be stored in cool, ventilated and dry place.
Certification:
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