Low Cost 0.96 Inch OLED Display 128X64 IIC I2C SPI 8080 Interface 30 Pins ZIF FPC
Wholesales Price 0.96 Inch OLED Display Product Introduction
The 0.96-inch OLED display screen is a small self luminous display device that is widely used in various smart devices and instruments due to its lightweight, low power consumption, high contrast, and wide viewing angle characteristics. 0.96-inch OLED displays typically use SSD1315 / SSD1306 driver chips and support multiple interface modes, including 6800 and 8080 parallel, 3-wire or 4-wire serial SPI, and IIC interface mode. This type of display screen has self luminous characteristics and does not require a backlight, resulting in better display performance, faster response speed, and a wider viewing angle.
The 0.96-inch OLED display produced by SAEF TECHNOLOGY is widely used in smartphones, smartwatches, health monitoring devices, industrial control systems, portable game consoles, and other occasions that require small and efficient displays. With the continuous advancement of technology and the growth of market demand, the 0.96-inch OLED display from SAEF TECHNOLOGY is expected to be further optimized and improved in terms of display performance, energy efficiency, and cost-effectiveness. Meanwhile, with the rapid development of the Internet of Things and wearable devices, the application prospects of such small OLED displays will be even broader.
With the support of large-scale production, SAEF TECHNOLOGY controls production costs and optimizes production processes, resulting in extremely low costs for 0.96-inch small-sized OLED products, catering to the needs of a large number of users for mass production.
Features
| Items | Specification | Unit |
| Model No. | SFOS096XZ-7120AP | |
| Diagonal Size | 0.96 | Inch |
| Resolution | 128x 64 | Dots |
| Active Area | 21.740(W) x 11.175(H) | mm2 |
| Outline Dimension | 24.70(W) x 16.60(H) | mm2 |
| Pixel Pitch | 0.170(W) x 0.175(H) | mm2 |
| Pixel Size | 0.150(W) x 0.150(H) | mm2 |
| Driver IC | SSD1315Z | - |
| Display Color | White | - |
| Gray Scale | 1 | Bit |
| Interface | 4-SPI/I2C/8080 | - |
| IC Package Type | COG | - |
| Module Connecting Type | SOLDER | - |
| Thickness | 1.30 ±0.1 | mm |
| Weight | TBD±10% | g |
| Duty | 1/64 | - |
Outline Drawing
Interface Pin Definition
| No | Symbol | Description |
| 1 | NC | No connection. |
| 2 | C1N |
CXP/CXN-Pin for charge pump capacitor;Connect to each other with a capacitor |
| 3 | C1P | |
| 4 | C2P | |
| 5 | C2N | |
| 6 | VBAT | Power supply for charge pump regulator circuit. |
| 7,10 | NC | No connection |
| 8 | VSS | This is a ground pin |
| 9 | VDD | Power supply pin for core logic operation. |
| 11 | BS1 |
MCU bus interface selection pins. |
| 12 | BS2 | |
| 13 | CS | This is the chip select input.(active LOW) |
|
14 |
RES |
Reset signal input.when the pin is pulled LOW,initialization of the chip is excute. Keep this pin HIGH(i.e connect to VDD)during normal operation |
|
15 |
A0 |
This is Data/Command control pin. When it is pulled HIGH (i.e. connect to VDD), the data at D[7:0] is treated as data. When it is pulled LOW, the data at D[7:0] will be transferred to the command register. In I2C mode, this pin acts as SA0 for slave address selection. When 3-wire serial interface is selected, this pin must be connected to VSS. |
|
16 |
WR |
This is read / write control input pin connecting to the MCU interface. When 8080 interface mode is selected, this pin will be the Write (WR#) input. Data write operation is initiated when this pin is pulled LOW and the chip is selected. |
|
17 |
RD |
When connecting to an 8080-series microprocessor, this pin receives the Read (RD#) signal. Readoperation is initiated when this pin is pulled LOW and the chip is selected. When serial or I2C interface is selected, this pin must be connected to VSS. |
|
18 ~25 |
D0 ~D7 |
These are 8-bit bi-directional data bus to be connected to the microprocessor’s data bus. When serial interface mode is selected, D0 will be the serial clock input: SCLK; D1 will be the serialdata input: SDIN and D2 should be kept NC. When I2C mode is selected, D2, D1 should be tied together and serve as SDAout, SDAin in application and D0 is the serial clock input, SCL. |
|
26 |
IREF |
This is segment output current reference pin. When external IREF is used, a resistor should be connected between this pin and VSS to maintain the IREF current at 30uA. When internal IREF is used, this pin should be kept NC. |
|
27 |
VCOMH |
The pin for COM signal deselected voltage level. A capacitor should be connected between this pin and VSS.Com |
|
28 |
VCC |
Power supply for panel driving voltage. This is also the most positive power voltage supply pin.When charge pump is enabled, a capacitor should be connected between this pin and VSS. |
| 29,30 | NC | No connection |
Absolute Maximum Rating
| Items | Min. | Max. | Unit |
| Supply Voltage(VDD) | -0.3 | +4.0 | V |
| Supply Voltage(VBAT) | -0.3 | +6.0 | V |
| Supply Voltage(VCC) | 0 | +18.0 | V |
| Operating Temperature(TOP) | -40 | 70 | ℃ |
| Storage Temperature(TST) | -40 | 85 | ℃ |
DC Characteristics
| Items | Symbol | Min. | Typ. | Max. | Unit | |
|
Supply Voltage |
Logic Supply Voltage IC | VDD | 1.65 | 3.0 | 3.5 | V |
| Charge Pump Regulator Supply VoltageIC |
VBAT |
3.0 |
3.3 |
4.5 |
V |
|
|
Operating (for OLED panel) |
VCC |
7.0 |
7.5 |
8.0 |
V |
|
|
Input Voltage |
High Voltage | VIH | 0.8 x VDD | - | VDD | V |
| Low Voltage | VIL | 0 | - | 0.2 x VDD | V | |
|
Output Voltage |
High Voltage | VOH | 0.9 x VDD | - | VDD | V |
| Low Voltage | VOL | VSS | - | 0.1 x VDD | V | |
Product Images
Reliability Test
| No. | Item | Condition | Quantity |
| 1 |
High Temperature Storage (HTS) |
85±2℃, 200 hours | 3 |
| 2 |
High Temperature Operating (HTO) |
70±2℃, 96 hours | 3 |
| 3 |
Low Temperature Storage (LTS) |
-40±2℃, 200 hours | 3 |
| 4 |
Low Temperature Operating (LTO) |
-40±2℃, 96 hours | 3 |
|
5 |
High Temperature / High Humidity Storage (HTHHS) |
50±3℃, 90%±3%RH, 120 hours |
3 |
|
6 |
Thermal Shock (Non-operation) (TS) |
-20±2℃ ~ 25℃ ~ 70±2℃ (30min) (5min) (30min) 10cycles |
3 |
| 7 | Vibration (Packing) |
10~55~ 10Hz,amplitude 1.5mm, 1 hour for each direction x, y, z |
1 Carton |
| 8 | Drop (Packing) | Height : 1 m, each time for 6 sides, 3 edges, 1 angle | 1 Carton |
| 9 | ESD (finished product housing) | ±4kVR:330Ω; C:150pF 10times,air discharge | 3 |
Facilities and Certificates
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