Application Description:

This product is suitable for the lead-free reflow soldering process. According to DIN EN 61760-1 and DIN EN 60068-2-58 standards, the maximum temperature it can withstand is 260 ℃. As the components to be processed for specific applications vary in specifications, structures, accuracy, etc., and the welding machines and fluxes used by users are different, we recommend users conduct tests before formal welding to ensure a high fit between products and production processes.

Explain

Because the specific temperature and time of reflow soldering will vary, the wiring terminals may have a certain color deviation. However, it will not affect the use function of the wiring terminal.

Proposal

Suggestions for SMD (surface mount device) location template:

Formwork thickness: 150 m. In addition, the opening position of the template shall be consistent with the welding hole on the PCB.

Connection