Description

PVD (Physical Vapour Deposition) sputtering targets are source materials used to deposit thin films on substrates through the sputtering process. These targets are made by processing high-purity metals or ceramics using advanced technologies such as melting, sintering, synthesis, and precision machining.

We provide sputtering target products in a wide range of materials, purities, and shapes. Each target is fabricated according to the customer’s specific application and material requirements to ensure optimal film quality and performance.

Specifications

Applications

Titanium Targets

Used in hardware tool coatings, decorative coatings, semiconductor components, and flat panel displays. Titanium targets are critical materials for integrated circuit fabrication, typically requiring purities above 99.99%.

Aluminum Targets

Commonly used in semiconductor and optical applications. Aluminium offers excellent heat resistance and reflectivity, making it ideal for coatings on electronic and packaging materials.

Copper Targets

Used for applications demanding superior electrical conductivity, including electrodes, interconnects, and electromagnetic shielding films.

Tin Targets

Applied to enhance corrosion resistance and solderability of base materials.

Zinc Targets

Provide corrosion protection and are used in cathodic coatings, batteries, and anti-corrosive paint formulations.

Precious Metal Targets (Gold, Silver, Platinum)

Offer exceptional chemical inertness and electrical conductivity, suitable for high-end electronics, medical devices, and precision instruments.