Ti Ti-Al Zr Cr Fe Cu PVD Coating Sputtering Targets 100*40mm 95*45mm 98*10mm

Description

Sputtering targets are source materials used to deposit thin films through the sputtering process. These targets are manufactured by processing metals or ceramics through techniques such as melting, sintering, and precision machining.
We provide sputtering targets made from a wide range of materials, purities, and shapes. By combining advanced technologies in material synthesis and mechanical processing, we can produce targets optimized for your specific application. Each target is fabricated according to the best method suitable for its material and intended use.

Specification

Applications

Titanium Targets

Titanium sputtering targets are widely used for hardware tool coatings, decorative coatings, semiconductor components, and flat-panel display coatings. Titanium is a key material in integrated circuit fabrication, typically requiring purity above 99.99%.

Aluminum Targets

Aluminum targets are versatile and used in semiconductor and packaging coatings. Due to excellent heat resistance, aluminum is also suitable for thermal management coatings and vacuum deposition.

Copper Targets

Copper targets are used for coatings that require high electrical conductivity, such as electrodes, wiring films, and conductive layers in electronic components.

Tin Targets

Tin targets are applied to improve surface corrosion resistance and are commonly used in protective coatings for electronics and glass.

Zinc Targets

Zinc targets serve as corrosion-resistant coatings and cathode layers. They are widely applied in batteries, paints, and chemical industries.

Precious Metal Targets (Pt, Ag, Au)

Gold, silver, and platinum targets are used for high-end sputtering applications requiring superior chemical inertness and conductivity—ideal for sensors, instruments, and electronic components.