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China NVIDIA MCX753436MS-HEAT Dual-Port QSFP112 PCI-X OCP3.0 Wireless Internal Server NIC in Stock for sale

NVIDIA MCX753436MS-HEAT Dual-Port QSFP112 PCI-X OCP3.0 Wireless Internal Server NIC in Stock

Price Negotiable
Price: 1650usd/pcs
MOQ: 1 pcs
Delivery Time: 7-10 days
Brand: NVIDIA
Product Description
NVIDIA MCX753436MS-HEAT Dual-Port QSFP112 PCI-X OCP3.0 Network Interface Card
The NVIDIA MCX753436MS-HEAT ConnectX-7 200GbE network adapter delivers high-performance connectivity with dual-port QSFP112 configuration, supporting both NDR200 InfiniBand and Ethernet protocols. This OCP3.0 compliant network card features advanced thermal management and PCIe 5.0 interface for optimal server integration.
Key Features
  • Dual-port QSFP112 connectivity supporting 200GbE speeds
  • PCIe 5.0 x16 interface for maximum bandwidth
  • OCP 3.0 specification compliance
  • Advanced thermal management with integrated heatsink
  • NDR200 InfiniBand and Ethernet protocol support
  • Optimized for internal server deployment
NVIDIA ConnectX-7 Network Card Front View
Front view of NVIDIA ConnectX-7 network card
NVIDIA ConnectX-7 Technical Specifications
Technical specifications and features
NVIDIA ConnectX-7 Port Details
Network port and connectivity details
NVIDIA ConnectX-7 Component Layout
Internal component layout and design
NVIDIA ConnectX-7 Performance Metrics
Performance metrics and benchmarks
NVIDIA ConnectX-7 Installation Guide
Installation and setup guidance
NVIDIA ConnectX-7 Cooling Solution
Cooling and thermal management features
NVIDIA ConnectX-7 Compatibility Information
Compatibility and system requirements
Technical Specifications
Interface PCIe 5.0 x16
Form Factor OCP 3.0
Port Configuration Dual-port QSFP112
Data Rate 200GbE (NDR200)
Protocols InfiniBand, Ethernet
Thermal Solution Integrated heatsink with advanced cooling
Application Internal server network interface
Applications & Compatibility
This high-performance network adapter is designed for enterprise data centers, HPC environments, and cloud infrastructure requiring maximum network throughput. The OCP 3.0 form factor ensures compatibility with modern server platforms while the advanced thermal design maintains optimal operating temperatures under heavy workloads.
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Company TOPSTAR TECHNOLOGY INDUSTRIAL CO., LIMITED
Location 28 Yayuan Road,Wuhe Community,BanTian Street,Longkong District, Shenzhen,China.
Contact Person Vicky Tian

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