High Transparency BOPET Film with Zero Transverse Heat Shrinkage and Excellent Surface Treatment for Electronic Printing
HT10 Clear BOPET Film is a premium 50μm BOPET film specially developed for FPC (Flexible Printed Circuit) and FFC (Flat Flexible Cable) printing applications. Engineered with outstanding dimensional stability, excellent ink adhesion, high electrical insulation, and reliable surface performance, HT10 provides a stable substrate for conductive circuit printing, insulating layers, and flexible electronic structures.
Designed for precision electronic manufacturing, HT10 helps improve printing accuracy, reduce production defects, and ensure long-term electrical reliability throughout the converting process.
Unlike general-purpose PET films, HT10 is optimized for precision electronic printing, where dimensional stability and insulation directly affect circuit quality and manufacturing yield.
| Key Performance | Technical Data | Benefits for FPC & FFC Manufacturers |
|---|---|---|
| Zero Transverse Heat Shrinkage | TD Heat Shrinkage: 0.0% | Maintains accurate circuit registration during screen printing, curing, and laminating, preventing misalignment in fine-line FPC and FFC production. |
| Excellent Surface Treatment | Surface Tension: 56.0 mN/m (Dyne Test Pass) | Promotes strong adhesion of conductive silver inks, carbon inks, dielectric coatings, and insulating layers while reducing ink peeling. |
| Reliable Electrical Insulation | Dielectric Breakdown: 263 V/μm | Provides excellent electrical insulation for printed circuits, helping improve product safety and long-term operational stability. |
| Premium Surface Protection | PE Protective Film (Standard Configuration) | Protects the printing surface from dust, scratches, and electrostatic contamination before processing, ensuring cleaner production and higher yield. |
| High Mechanical Strength | MD 215 MPa / TD 242.5 MPa | Delivers excellent handling performance during roll-to-roll printing, die-cutting, and automated manufacturing. |
| High Transparency | 50 μm Clear BOPET Film | Enables easy visual inspection, optical positioning, and precise quality control throughout the production process. |
HT10 is designed for high-precision electronic printing and is widely used in:
- FPC (Flexible Printed Circuit) Printing
- FFC (Flat Flexible Cable) Printing
- Printed Flexible Circuit Layers
- Flexible Sensor Substrates
- Conductive Silver Circuit Printing
- Carbon Ink Printed Circuits
- Insulating Dielectric Layers
- Flexible Electronic Components
| Film Type | Clear BOPET Film |
| Thickness | 50 μm |
| Dielectric Breakdown Voltage | 263 V/μm |
| Surface Tension | 56.0 mN/m |
| Cross Cut Adhesion | 100/100 |
| TD Heat Shrinkage | 0.0% |
| Tensile Strength (MD) | 215 MPa |
| Tensile Strength (TD) | 242.5 MPa |
| Protective Film | Green PE Protective Film |
| Roll Width | 1020 mm |
As a professional BOPET film manufacturer, we understand the performance requirements of precision electronic printing. HT10 is manufactured to provide consistent dimensional stability, excellent printability, and reliable insulation for demanding FPC and FFC production. We also offer customized thicknesses, roll widths, and technical support to help optimize your manufacturing process.
Contact us today to request samples or discuss your FPC and FFC printing requirements.
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