Croll Technology (Shenzhen) Co., Ltd.
                                                                                                           
Verified Supplier
10 Years
Since 2016
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Advanced 22 Layer Electronic Circuit Board Design Custom Android Pcba Develop

Price Negotiable
Price: US$ 1.18~2.73/piece
MOQ: 1piece
Delivery Time: 14 working days
Brand: CRT
Product Description

Shenzhen Custom Android PCBA Develop Design Service PCB Board Manufacturer


Advantages:
1) Professional engineer team --help you to check design and do engineering before production
2) Rich experiences in PCB production industry--provide high quality and competitive price PCB
3) After-sales service--every problem you have will get our professional advice and solution
4) Constant follow up-- make us have the fast reaction of your requirement
5) Inspected by the Inspection Institution


Specifications:

Process Capability We provide the following services
PCB maximum size 550x450mm

1. HDI PCB samples, mass production/ PCBA samples, mass production
2. SMT chip processing
3. Plugin processing
4. After welding
5. PCBA semi-finished product production
6. Machine assembly

PCB minimum size 30x30mm
PCB minimum thickness 0.2mm
PCB shape Unlimited
Whether to support single-sided/double-sided Yes
Minimum component size 201
Component height 0.2-25mm
Minimum gap 0.5mm
Minimum BGA 0.2mm
Maximum component size 55mmx55mmx15mm
SMT patch part type SOP, SOT, QFN, QFP, BGA, Bonding
Is it possible to mount the connector Yes
Whether it can be wave soldered Yes


Through Hole Assembly Capability:
Many high power, high reliability, and legacy products continue to be built with through hole components and Bandary will continue to serve these customers with Automated Axial Insertion, Hand Assembly, Wave Soldering, Selective Soldering, and Hand Soldering.
1. Universal Axial insertion
2. Terminal insertion
3. Custom Lead Forming Equipment
4. Pb & Pb Free Wave Solder
5. Selective Soldering
6. In-Line Continuous Depaneler

 

SMT Assembly Capability:
1. Panelized
2. Fine pitch and high count BGAs, Minimum package components(01005), POP, Chip on Board, RF microelectronics, press fit connectors, fiber optics.
3. Mixed processes (tin-lead and lead-free), lead-through holes, wave soldering , double-sided and single-sided reflow soldering, wide body and backplane.
4. Inspection and testing using online SPI ,online AOI ,X-Ray equipment.


Picture Details:

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Croll Technology (Shenzhen) Co., Ltd.
Location No.1302,Building 2,Manjinghua Science and Technology Workshop,No. 6, Songjiang Road, Songgang,Bao'an District,ShenZhen, China
Contact Person Ian Siu

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