16 Layer Multilayer PCB Assembly Buried Resistance Circuit Board
16 Layer Multilayer PCB Assembly Buried Resistance Circuit Board
16 Layer Multilayer Printed Circuit Board Assembly Buried Resistance
PCB Assembly Manufacturing Procedures:
Program Management
PCB Files → DCC → Program Organizing → Optimization → Checking
SMT Management
PCB Loader → Screen Printer → Checking → SMD Placement → Checking → Air Reflow → Vision Inspection → AOI → Keeping
PCBA Management
THT→Soldering Wave (Manual Welding) → Vision Inspection → ICT → Flash → FCT → Checking → Package → Shipment
Specification:
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Multilayer PCB
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Special Tech
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Application Segment:
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Auto,Industrial,Medical,DataCom,Consumer
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1.Impedance
2.Via Filling 3.PFH,Backdrill 4.Mix Finishes 5.Cave 6.heatsink 7.ENEPIG |
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Layer Count:
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4~50L
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Material:
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FR4 (Tg130~Tg170)
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Board Thickness(mm):
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0.6mm~10.0mm
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Copper Thickness(oz):
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Hoz~3oz
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Size(mm):
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5mm~1200mm
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Min. LW/LS(mm):
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0.1/0.1
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Min. Hole(mm):
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0.25
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Solder Mask:
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Green, Yellow, Blue, Black, White...
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Surface Finish:
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ENIG,OSP,HASL,Imm Tin,Imm Silver...
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Certificate:
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RoHS/ISO9001/ISO14001
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Service:
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OEM / DFM
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Product Image:
1. Payment: T/T in advance (Western Union , paypal is welcomed)
2. Production lead time 100PCS: 5-7days, 500~1000PCS: 7-10days, above 1000PCS 15-20days.
3. Sample can be delivered in 3days
4. Shipping freight are quoted under your requests
5. Shipping port: Shen zhen,Mainland China
6. Discounts are offered based on order quantities
7. MOQ: 1PCS
Our service
1. SMT service;
2. Design service, Gerber drawings;
3. Good quality and fast delivery with lower price than double side PCB.
4. Specifications of LEAD Free HASL 1 Layer / Single Side Rigid PCB/PCBA:
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.