Bisphenol A-Type Solid Epoxy Resin Low And Medium Molecular Weight HW901
Low And Medium Molecular Weight Bisphenol A-Type Solid Epoxy Resin HW901
Solid Epoxy Resin HW901 is low and medium molecular weight bisphenol A-type solid epoxy resin, with fine chemical stability, strong adhesion and better toughness. It fits combining the amine curing agent or its addition compound that make up the reactive solvent coating compound. It can be hardening at room temperature or higher temperature. Because of these properties it finds use in various applications.
The physical and chemical properties
| Test Item | Specification |
| Color ,Gardner | 1max |
| EEW,g/eq | 450-500 |
| Hydrolyzable Chloride,eq/100g | ≤0.003 |
| Inorganic Chlorine,eq/100g | ≤0.0005 |
| Volatile content ,% | ≤0.2 |
| Softening point,℃ | 68-73 |
Application
Anti-corrosive coating, electrophoretic coating, powder coating, coating for baking varnish for can manufacturing, roller steel coating and coating for iron printing etc.
It may be mixed with amine or polyamide curing agent to product cold-setting paint or amino resin to produce baking coating or other modified materials.
Storage
Store in a cool, dry and well ventilated area. Keep away from ignition sources, heat and flame and sunlight.
Package
25Kg/bag
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