ShenZhen Mingjiada Electronics Co.,Ltd.
                                                                                                           
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8GB eMMC 5.1 NAND Flash Memory IC Chip with BGA-153 Package for Industrial Wide Temperature Range Applications

Price Negotiable
Price: Contact for Sample
MOQ: 10
Delivery Time: 3-5 work days
Brand: Original Factory
Product Description
FEMDRW008G-88A39 Memory IC Chip 8GB eMMC 5.1 Embedded NAND Flash Memory IC BGA-153
FEMDRW008G-88A39 Memory IC Chip 8GB eMMC 5.1 Embedded NAND Flash Memory IC BGA-153
Product Description
FEMDRW008G-88A39 is an 8GB eMMC embedded memory chip that complies with the JEDEC eMMC 5.1 standard and is based on 3D TLC NAND. It is primarily designed for embedded applications with high requirements for stability and temperature tolerance, such as industrial control, communication base stations, smart grids and in-vehicle pre-installation systems.
Specifications
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NAND (MLC)
Memory Size 8GByte (NAND)
Memory Interface eMMC_5.1
Clock Frequency 200 MHz
Write Cycle Time - Word, Page 5ns
Voltage - Supply 1.8V ~ 3.3V
Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount
Package / Case 153-BGA
Features
  • Storage and Performance: Capacity: 8GB, utilising MLC NAND flash. Sequential read speed: up to approximately 230MB/s; sequential write speed: up to approximately 105MB/s. Supports high-speed modes such as HS400 and HS200. Selectable bus width: 1/4/8 bits. Maximum interface clock frequency: 200 MHz
  • Interface and Power Supply: eMMC 5.1 interface, backwards compatible with eMMC 4.41/4.5/5.0. NAND operating voltage VCC 2.7-3.6V; controller operating voltage VCCQ supports two ranges: 1.7-1.95V and 2.7-3.6V. Typical NAND standby current: 50µA; typical controller standby current: 120µA
  • Temperature and Reliability: Operating temperature: -40°C to +85°C (industrial wide temperature range). Integrated hardware ECC, global wear levelling, bad block management and a unique firmware backup mechanism. Supports power-loss protection, boot partition, RPMB, sleep/wake-up and other functions
  • Package and Compliance: 153-BGA (FBGA153, approx. 11.5×13×1.0 mm) package, surface mount
Applications
  • Industrial control motherboards, PLCs, HMIs
  • Communication base stations, edge computing gateways
  • Smart grids, rail transport equipment
  • In-vehicle infotainment systems
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Frequently Asked Questions
Q. Are your products original?
A: Yes, all products are original, new original import is our purpose.
Q: Which Certificates do you have?
A: We are ISO 9001:2015 Certified Company and member of ERAI.
Q: Can you support small quantity order or sample? Is the sample free?
A: Yes, we support sample order and small order. Sample cost is different according to your order or project.
Q: How to ship my order? Is it safe?
A: We use express to ship, such as DHL, Fedex, UPS, TNT, EMS. We can also use your suggested forwarder. Products will be in good packing and ensure the safety and we are responsible to product damage to your order.
Q: What about the lead time?
A: We can ship stock parts within 5 working days. If without stock, we will confirm lead time for you based on your order quantity.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company ShenZhen Mingjiada Electronics Co.,Ltd.
Location 1239 New Asia Guoli Building Zhenzhong Road.,Futian district Shenzhen China
Contact Person Sales Manager

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