Mold forming epoxy resin APG injection process high temperature curing adhesive
Brief Introduction
LE-8316L is a modified BPA-type epoxy resin, combined with LH-8316L, a liquid modified carboxylic anhydride hardener. This system is designed for mold forming and APG injection processes, providing high-temperature curing capabilities.
Applications
This epoxy resin is ideal for low-voltage electrical applications, including electronics, cable insulation, bonding, and sealing. It is particularly suited for sealing and connecting insulation products, as well as current and voltage transformers.
Processing Methods
Processing can be carried out using a conventional gravity casting method under vacuum conditions. The production process can also be tailored to align with the client's existing manufacturing techniques.
Properties
This two-component epoxy resin system consists of LE-8316L and LH-8316L, both in liquid form at room temperature. It is suitable for casting processes, with a glass transition temperature (Tg) ranging between 60-80°C, ensuring durability under elevated temperatures.
Formulation
| Epoxy resin | LE-8316L | 100 pbw |
| Hardener | LH-8316L | 100 pbw |
| Filler | Silica powder | 300 - 400 pbw |
| Color paste | LC series * | Appropriate pbw |
Advantage
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