High Flexibility Electrical Epoxy Resin with Low Curing Shrinkage and Glass Transition Temperature 100-120°C for Electrical Insulation
Premium-grade adhesive solution engineered for critical electrical insulation and bonding applications. This light yellow to colorless liquid combines exceptional mechanical strength with superior dielectric properties, making it ideal for sealing and protecting sensitive electronic components in demanding environments.
- High Impact Resistance: Withstands 10-18kJ/m² (ISO179) for durable component protection
- Low Electrical Loss: Minimal dissipation factor of 0.02 ensures energy efficiency
- Thermal Stability: Glass transition temperature (Tg) of 100-120°C (ISO11357-2)
- Flame Retardant: HB flammability rating (4mm thickness) enhances safety
- Precision Curing: Controlled shrinkage (0.6-0.8%) maintains dimensional accuracy
| Property | Test Standard | Value Range |
|---|---|---|
| Compressive Strength | ISO604 | 150-200 N/mm² |
| Flexural Strength | ISO178 | 110-140 N/mm² |
| Tensile Strength | ISO527 | 60-85 N/mm² |
| Epoxy Value | ISO3001 | 4.4-4.9 |
| Density at 25°C | ISO1675 | 1.16-1.2 g/cm³ |
| Dielectric Strength | - | 20-30 kV/mm |
| Cure Temperature | - | 130-140°C |
| Viscosity at 25°C | ISO12058 | 5.5-8.5 MPa*s |
Transformer and bushing insulation
Circuit board encapsulation
High-voltage cable jointing
Switchgear component bonding
Aerospace electrical systems
A: REACH/RoHS/UL/SGS certifications with custom compliance options.
A: 240 KG with standard 20KG/220kg packaging.
A: Guaranteed dispatch within 10 business days.
A: Yes, technical parameters can be adjusted for specialized applications.
A: L/C and T/T transactions.
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