Epoxy Resin with Mold Release Agent for Electrical Insulation

Price Negotiable

Price: $3.40-3.60

MOQ: 1

Delivery Time: Negotiable

Brand: WENYOU

Product Description

China Epoxy Resin with Mold Release Agent and Mold Cleaner

Product Specifications

Attribute	Value
CAS No.	1675-54-3
Other Names	Epoxy resin potting compound
MF	C21H24O4
EINECS No.	216-823-5
Classification	Double Components Adhesives
Main Raw Material	EPOXY
Usage	Construction, Transformer, insulator, bushing
Type	Epoxy Resin Compound
Certification	ISO 18000
Application	Electrical power insulation
Composition	Two component resin system
Product name	epoxy resin and hardener
Appearance	Transparent liquid
Packing	20kg/pail or 220kg/drum or 1200kg/tank
Brand	Wenyou

Product Description

LD605 is mainly used as a release agent for epoxy resin products, especially for difficult-to-release, complex mold insulating parts, transformers, high-voltage switches, dry-type transformers, and other epoxy carbon fiber products.

Key Performance Features

Clean, colorless, oil-free with excellent surface adhesion
Easy to operate and apply
Does not transfer to molded products and improves product appearance
Fast air curing capability
Maintains mold cleanliness for extended periods, reducing defective rates
Supports multiple demolding cycles with single application
Reduces dirt accumulation on mold surfaces

Application Instructions

For optimal release effect, first clean the mold surface with cleaning agent to remove all traces of previous release agents. Application methods include brushing, spraying, scraping, or dipping. Production can begin immediately after solvent evaporation.