Semiconductor Grade Clean Component Sulfuric Acid Anodizing Line for High-Purity Aluminum Substrates
This fully automatic clean-type sulfuric acid anodizing line is engineered exclusively for high-purity aluminum semiconductor components. It produces uniform 8-15 μm natural clear oxide film without metallic salt dyeing contamination. The line supports hot water sealing or medium-temperature nickel-free sealing to meet strict semiconductor cleanliness and outgassing requirements.
| Item | Parameter |
|---|---|
| Applicable Workpiece | Semiconductor clean components, high-purity aluminum substrates |
| Anodizing Type | Low contamination sulfuric acid decorative anodizing |
| Oxide Film Thickness | 8-15 μm |
| Surface Appearance | Natural clear finish (no metallic salt coloring, zero ion contamination risk) |
| Sealing Options | Hot water sealing / Medium-temperature nickel-free sealing |
| Operation Mode | Fully automatic clean anodizing line |
| Cleanliness Control | Low-ion bath formulation, dedicated clean circulation & filtration system |
| Key Restriction | Dyeing process prohibited to avoid heavy metal contamination |
- Degreasing (low-surfactant clean degreasing)
- Multi-stage pure water rinsing
- Mild desmut treatment
- High-purity sulfuric acid anodizing
- Continuous ultra-pure water cascade rinsing
- Sealing: Hot water sealing / Medium-temperature nickel-free sealing
- Final pure water rinsing
- Controlled low-temperature drying
- Fully automatic running mode ensures consistent film thickness within 8-15 μm across batches
- Metallic salt dyeing is eliminated to prevent ionic pollution that affects semiconductor performance
- Supports nickel-free sealing solutions, complying with semiconductor industry environmental and outgassing standards
- Equipped with high-precision continuous filtration & ultra-pure water supply to maintain bath cleanliness
- Strictly controlled rinsing cascades minimize residual acid and foreign particle carryover
- Pre-treatment tank group
- High-purity sulfuric acid anodizing tank
- Multi-stage UPW rinsing system
- Sealing tank (hot water / nickel-free medium-temperature sealing)
- DC anodizing rectifier
- High-precision circulation filter system
- Clean low-temperature drying oven
- Waste gas & wastewater treatment unit
- PLC automatic gantry crane & central control system
Metal ions from colorants may remain inside the oxide film, causing ion migration, contamination and reliability risks for semiconductor assemblies. Natural clear anodizing is adopted.
Medium-temperature nickel-free sealing avoids nickel ion residue. It satisfies semiconductor requirements for low outgassing and heavy-metal-free surfaces.
The main configuration is fully automatic for mass production; a semi-automatic / manual clean module can be supplied as an optional upgrade for sampling orders.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.