Beijing Plink AI Technology Co., Ltd
                                                                                                           
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275 TOPS AI Medical Industrial IPC Embedded Computer NVIDIA Jetson AGX Orin

Price Negotiable
Price: To be negotiated
MOQ: 1set
Delivery Time: 15-30 work days
Brand: PLINK
Product Description

275 TOPS AI Medical Industrial IPC Embedded Computer NVIDIA Jetson AGX Orin

NVIDIA Jetson AGX Orin 64G Industrial Embedded Computer

The NVIDIA Jetson industrial embedded pc (ORIN64-8F4E1) is with NVIDIA Jetson AGX Orin core module and the AI-enabled NVIDIA RTX 6000/A6000 GPU. Each reference application utilizes the necessary I/O components and drivers to move data and feed it into the processing pipeline on the RTX 6000 /A6000 GPU, providing a functionally tested data path setup, and it is the high performance embedded computing with NVIDIA Jetson AGX Orin 64G Module, the AI performance of Jetson AGX Orin module is 275 TOPS,The HD Audio-Video Subsystem uses a collection of functional blocks to off-load audio and video processing activities fromthe CPU complex, resulting in fast, fully concurrent, highly efficient operation.

 

This subsystem is comprised of the following:

  • (2x) Multi-Standard Video Decoder
  • (2x) Multi-Standard Video Encoder
  • JPG Processing Block
  • Video Image Compositor (VIC)
  • Audio Processing Engine (APE)

 

The initial setting can be reset and restored

Maximum scalability 512g TF card memory

4G and WIFI module can be extended

 

Optional expansion 32GB ~ 1TB SSD storage
Processor AGX Orin module
GPU NVIDIA RTX 6000/A6000
Memory 64G
Weight 5500g
Power requirements 220V
Size 335mm*257mm*146mm
Working temperature -20~+65℃

 

 

 

 

 

NVIDIA Jetson Orin 64GB Technical Specifications

 

Power 15 W | 30 W | 50 W, and up to 60 W
CPU 12-core Arm® Cortex®-A78AE v8.2 64-bit CPU
3MB L2 + 6MB L3
GPU 2048-core NVIDIA Ampere architecture GPU with 64 Tensor Cores
Vision and DNN accelerators Up to 105 INT8 TOPS (Sparse, Deep Learning Inference)
Memory 64 GB LPDDR5
Storage 64 GB eMMC 5.1
AI Performance 275 TOPS
Display 1×: shared HDMI™ 2.1, eDP1.4, VESA® DisplayPort™ (DP) HBR3
Ethernet 1x GbE: RGMII 1× 10GbE: MGBE by XFI
PCIe PCI Express 4.0 x1, x2, x4 and x8 Up to 2x Endpoint supported
USB 3x: USB 3.2 4x: USB 2.0
Other UART, SPI, CAN, I2C, I2S, GPIOs
Module dimensions 100.0 mm × 87.0 mm × 16.0 mm
Temperature range (at Thermal Transfer Plate (TTP) surface) -25 °C to 80 °C
Operating humidity 5% to 85% RH
Storage temperature -25 °C to 80 °C
Storage humidity 30% to 70% RH

 

Note: See the NVIDIA Jetson AGX Orin Design Guide for details on the UPHY configurations supported. MGBE, USB 3.2, and PCIe share UPHY Lane.

 

NVIDIA Ampere GPU

Advanced GPU including CUDA cores, Ray-Tracing (RT) cores and 3rd Generation Tensor cores | Enhanced compute capability

2 GPC | 8 TPC | Up to 170 INT8 Sparse TOPS or 85 FP16 TFLOPS | Up to 5.32 FP32 TFLOPS or 10.649 FP16 TFLOPS (CUDA cores)

 

Arm Cortex-A78AE CPU

12× Arm Cortex-A78AE cores | 3 CPU clusters (4 cores/cluster) | 259 SPECint_rate2006

Arm® v8.2 (64-bit) | Symmetric multi-processing (SMP) | NEON SIMD | High-performance coherent interconnect fabric

 

Module Mechanical Drawing Side View

 

RTX 6000 /A6000 Specifications

 

  RTX 6000 RTX A6000
NVIDIA CUDA Cores 4608 10752
NVIDIA Tensor Cores 576 336
GPU Memory 24GB GDDR6 48GB GDDR6
Memory interface 384-bit
Memory Bandwidth Up to 672 GB/s Up to 768 GB/s
Max Power Consumption 295 W 300 W
NVIDIA NVLink bandwidth 100GB/s (bidirectional) 112.5GB/s (bidirectional)
Error-correcting code (ECC) Yes

 

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Company Beijing Plink AI Technology Co., Ltd
Location C1106,Jinyu Jiahua Building,Shangdi 3rd Street, Haidian District, Beijing 100085, P.R.China
Contact Person Cindy

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