Beijing Plink AI Technology Co., Ltd
                                                                                                           
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17 Years
Since 2009
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Industrial Embedded Automation Computers IPC Box AGX Orin 275 TOPs

Price Negotiable
Price: To be discussed
MOQ: 1SET
Delivery Time: 15-30 work days
Brand: PLINK
Product Description

Industrial Embedded Automation Computers IPC Box AGX Orin 275 TOPs
 
PLINK Self-developed NVIDIA IPC (
ORIN64-8F2E1)

 
NVIDIA Jetson AGX Orin 64G
 

Up to 275  TOPS (INT8)

Arm Cortex-A78AE CPU

Maximum Module Power: Up to 60 W

64GB 256-bit LPDDR5 DRAM

64GB eMMC 5.1 Flash Storage | Bus Width: 8-bit | Maximum Bus Frequency: 200 MHz (HS400 or HS533)

Unleash the power of an accelerated platform for Automation and AI.

AI and robotics across industries

See PLINK's Isaac platform deployed at the edge for autonomous mobile robotics, industrial automation, healthcare, retail, agriculture, and more.

Simulate and Test

Robots are virtually trained and tested in photorealistic and physically accurate environments using NVIDIA Isaac Sim operating in the NVIDIA Omniverse  virtual environment.

Develop Applications

High-performance robotics applications can be developed using hardware-accelerated SDKs such as Isaac ROS GEMs for ROS-based robots, the NVIDIA  DeepStream SDK for streaming video understanding, NVIDIA Riva for natural language processing, and the Isaac SDK for a complete framework.

Deploy and Manage

Only NVIDIA offers a complete end-to-end workflow to enable seamless deployment. Robotics applications can be ported onto NVIDIA edge devices from NVIDIA Jetson to EGX edge computers to create truly autonomous machines. Scaling services across distributed edge cases are also available on EGX Fleet Command.
 
 

 
 

NVIDIA Jetson AGX Orin 64GB Embedded Computer
Technical Specification
 

ColorBlack

Module

NVIDIA Jetson AGX Orin 64G

AI Performance

275 TOPS

GPU

2048-core NVIDIA Ampere architecture GPU with 64 Tensor Cores

CPU

12-core Arm® Cortex®-A78AE v8.2 64-bit CPU 3MB L2 + 6MB L3

Memory

64GB 256-bit LPDDR5 204.8GB/s

Storage

64GB eMMC 5.1

Video Encode

2x 4K60 (H.265)
4x 4K30 (H.265)
8x 1080p60 (H.265) 16x 1080p30 (H.265)

Video Decode

1x 8K30 (H.265)
3x 4K60 (H.265)
7x 4K30 (H.265)
11x 1080p60 (H.265) 22x 1080p30 (H.265)

CAN

2

GPIO4
SPI1
I2C2
RS 2322
10/100/1000 Ethernet/RJ452
Debug1
Temperature Range-20~+65°C
Power Supply AC 220V
Dimensions 430 mm × 360 mm × 88mm
Weight6050g

 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 

 

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Plink AI Technology Co., Ltd
Location C1106,Jinyu Jiahua Building,Shangdi 3rd Street, Haidian District, Beijing 100085, P.R.China
Contact Person Cindy

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