Beijing Plink AI Technology Co., Ltd
                                                                                                           
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275 TOPS 64GB EMMC 5.1 AGX Orin Nvidia Jetson Compute Module For Healthcare Agriculture

Price Negotiable
Price: USD1680-USD1700/PCS
MOQ: 1PCS
Delivery Time: 15-30 work days
Brand: NVIDIA
Product Description

 

275 TOPS 64GB EMMC 5.1 AGX Orin Nvidia Jetson Compute Module For Healthcare Agriculture

 

 

NVIDIA Jetson AGX Orin 64GB Module

 

All NVIDIA Jetson modules and developer kits are supported by the same software stack, enabling you to develop once and deploy everywhere. Jetson Software is designed to provide end-to-end acceleration for AI applications and accelerate your time to market. We bring the same powerful NVIDIA technologies that power data center and cloud deployments to the edge.

 

 

The Jetson family of modules all use the same NVIDIA CUDA-X software, and support cloud-native technologies like containerization and orchestration to build, deploy, and manage AI at the edge.

 

With Jetson, customers can accelerate all modern AI networks, easily roll out new features, and leverage the same software for different products and applications.

 

 

 

 

NVIDIA Jetson AGX Orin 64GB Module Technical Specifications

Brand NVIDIA
Module NVIDIA Jetson AGX Orin 64GB
AI Performance 275 TOPS
GPU 2048-core NVIDIA Ampere architecture GPU with 64 Tensor Cores
Memory 64GB 256-bit LPDDR5
204.8GB/s
CPU 12-core Arm® Cortex®-A78AE v8.2 64-bit CPU
3MB L2 + 6MB L3
GPU Max Frequency 1.3 GHz
DLA Max Frequency 1.6 GHz
CPU Max Frequency 2.2 GHz
Safety Cluster Engine -
Display 1x 8K60 multi-mode DP 1.4a (+MST)/eDP 1.4a/HDMI 2.1
Storage 64GB eMMC 5.1
Camera Up to 6 cameras (16 via virtual channels)
16 lanes MIPI CSI-2
D-PHY 2.1 (up to 40Gbps) | C-PHY 2.0 (up to 164Gbps)
Video Encode 2x 4K60 (H.265)​
4x 4K30 (H.265)​
8x 1080p60 (H.265)​
16x 1080p30 (H.265)​
Video Decode 1x 8K30 (H.265)​
3x 4K60 (H.265)​
7x 4K30 (H.265)​
11x 1080p60 (H.265)​
22x 1080p30 (H.265)​
PCIe Up to 2 x8 + 1 x4 + 2 x1
(PCIe Gen4, Root Port, & Endpoint)
Power 15W - 60W
Other I/O 4x UART, 3x SPI, 4x I2S, 8x I2C, 2x CAN, PWM, DMIC & DSPK, GPIOs
Mechanical 100mm x 87mm
699-pin Molex Mirror Mezz Connector
Integrated Thermal Transfer Plate


 

 


 

 

 

 

 

 

 

 

 

 

 

 

 

 

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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Plink AI Technology Co., Ltd
Location C1106,Jinyu Jiahua Building,Shangdi 3rd Street, Haidian District, Beijing 100085, P.R.China
Contact Person Cindy

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