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TS3USB221ARSER Ethernet Switch IC USB Switch ICs ESD Prot,Hi Spd USB 2.0 1:2 Mux/Demux Sw

Price Negotiable
Price: Contact us
MOQ: Contact us
Delivery Time: The goods will be shipped within 3 days once received fund
Brand: Ti
Product Description

TS3USB221ARSER Ethernet Switch IC USB Switch ICs ESD Prot,Hi Spd USB 2.0 1:2 Mux/Demux Sw

 

1 Features

  • VCC Operation at 2.5 V to 3.3 V
  • VI/O Accepts Signals Up to 5.5 V

  • 1.8-V Compatible Control-Pin Inputs

  • Low-Power Mode When OE Is Disabled (1 μA)

  • RON = 6 Ω Maximum

  • ΔRON = 0.2 Ω Typical

  • Cio(on) = 6 pF Typical

  • Low Power Consumption (30 μA Maximum)

  • High Bandwidth (900 MHz Typical)

  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II

  • ESD Performance Tested Per JESD 22

    • – 7000-V Human-Body Model (A114-B, Class II)

    • – 1000-V Charged-Device Model (C101)

  • ESD Performance I/O to GND – 12-kV Human-Body Model

 

2 Applications

  • Routes Signals for USB 1.0, 1.1, and 2.0

  • Mobile Phones

  • Cameras

  • Notebooks

 

3 Description

The TS3USB221A device is a high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers with limited USB I/Os. The wide bandwidth (900 MHz) of this switch allows signals to pass with minimum edge and phase distortion. The device multiplexes differential outputs from a USB host device to one of two corresponding outputs. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. The device also has a low power mode that will reduce the power consumtion to 1 μA for portible applications with a battery or limited power budget. The device is designed for low bit-to- bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480 Mbps).

The TS3USB221A device integrates ESD protection cells on all pins, is available in a tiny μQFN package (2 mm × 1.5 mm) and is characterized over the free air temperature range from –40°C to 85°C.

Device Information

PART NUMBER

PACKAGE

BODY SIZE (NOM)

TS3USB221A

UQFN

1.50 mm × 2.00 mm

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Company ChongMing Group (HK) Int'l Co., Ltd
Location Room 1204, DingCheng International Building, 518028 Futian District, SHENZHEN, CN
Contact Person Doris Guo

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