LMZ31506RUQR Mosfet Power Transistor Non-Isolated DC/DC Converters 6A Power Module w/ 2.95V-14.5V Input

1 Features

• Complete Integrated Power Solution Allows Small Footprint, Low-Profile Design

• 9-mm × 15-mm × 2.8-mm package - Pin Compatible with LMZ31503

• Efficiencies Up To 96%

• Wide-Output Voltage Adjust
  0.6 V to 5.5 V, with 1% Reference Accuracy

• Supports Parallel Operation for Higher Current

• Optional Split Power Rail Allows Input Voltage down to 1.6 V

• Adjustable Switching Frequency (250 kHz to 780 kHz)

• Synchronizes to an External Clock

• Adjustable Slow-Start

• Output Voltage Sequencing / Tracking

• Power Good Output

• Programmable Undervoltage Lockout (UVLO)

• Output Overcurrent Protection (Hiccup Mode)

• Over-Temperature Protection

• Pre-bias Output Start-up

• Operating Temperature Range: –40°C to 85°C

• Enhanced Thermal Performance: 13°C/W

• Meets EN55022 Class B Emissions - Integrated Shielded Inductor

• Create a Custom Design Using the LMZ31506 With the WEBENCH® Power Designer

   

2 Applications

• Broadband & Communications Infrastructure

• Automated Test and Medical Equipment

• Compact PCI, PCI Express and PXI Express

• DSP and FPGA Point of Load Applications

3 Description

The LMZ31506 power module is an easy-to-use integrated power solution that combines a 6-A DC-to- DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package. This total power solution allows as few as three external components and eliminates the loop compensation and magnetics part selection process.

The 9×15×2.8 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation with a thermal impedance of 13°C/W junction to ambient. The device delivers the full 6-A rated output current at 85°C ambient temperature without airflow.

The LMZ31506 offers the flexibility and the feature- set of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a robust and reliable power solution compatible with standard QFN mounting and testing techniques.