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MT29F64G08CBABAWP:B Nand Flash IC Memory Chip 8GX8 Plastic PBF TSOP 3.3V Mass Storage

Price Negotiable
Price: Negotiation
MOQ: 10PCS
Delivery Time: in stock 2-3days
Brand: MICRON
Product Description

 

MT29F64G08CBABAWP:B IC Memory Chip NAND FLASH 8GX8 PLASTIC PBF TSOP 3.3V MASS STORAGE

 

Features

 

• Open NAND Flash Interface (ONFI) 1.0-compliant1

• Single-level cell (SLC) technology

• Organization – Page size x8: 2112 bytes (2048 + 64 bytes) – Page size x16: 1056 words (1024 + 32 words) – Block size: 64 pages (128K + 4K bytes) – Plane size: 2 planes x 2048 blocks per plane – Device size: 4Gb: 4096 blocks; 8Gb: 8192 blocks 16Gb: 16,384 blocks

• Asynchronous I/O performance – tRC/tWC: 20ns (3.3V), 25ns (1.8V)

• Array performance – Read page: 25µs 3 – Program page: 200µs (TYP: 1.8V, 3.3V)3 – Erase block: 700µs (TYP)

• Command set: ONFI NAND Flash Protocol

• Advanced command set – Program page cache mode4 – Read page cache mode 4 – One-time programmable (OTP) mode – Two-plane commands 4 – Interleaved die (LUN) operations – Read unique ID – Block lock (1.8V only) – Internal data move

• Operation status byte provides software method for detecting – Operation completion – Pass/fail condition – Write-protect status

• Ready/Busy# (R/B#) signal provides a hardware method of detecting operation completion

• WP# signal: Write protect entire device

 

Product Attributes Select All
Categories Integrated Circuits (ICs)
  Memory
Manufacturer Micron Technology Inc.
Series -
Part Status Active
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NAND
Memory Size 64Gb (8G x 8)
Write Cycle Time - Word, Page -
Memory Interface Parallel
Voltage - Supply 2.7 V ~ 3.6 V
Operating Temperature 0°C ~ 70°C (TA)

 

 

 

 

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Company ChongMing Group (HK) Int'l Co., Ltd
Location Room 1204, DingCheng International Building, 518028 Futian District, SHENZHEN, CN
Contact Person Doris Guo

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